Ziziphi iiMfuno zoLawulo loBubushushu beOveni yokuBonelela kwakhona?

NeoDen IN12 Reflow Oven

1. Hlaziya i-ovenikwindawo nganye yobushushu ubushushu kunye nozinzo chain isantya, inokuqhutywa emva eziko kunye nokuvavanya ijiko lobushushu, ukusuka ebandayo uqalise umatshini kwiqondo lobushushu elizinzileyo ngokuqhelekileyo kwimizuzu engama-20 ~ 30.
2. Abachwephesha bomgca wemveliso ye-SMT kufuneka barekhode ukusetwa kweqondo lobushushu kunye nesantya setyathanga yonke imihla okanye kwimveliso nganye, kwaye baqhube uvavanyo olulawulwayo lomlinganiso wegophe lobushushu bomlilo rhoqo ukujonga ukusebenza okuqhelekileyo.i-reflow soldering.I-IPQC iya kuqhuba uhlolo kunye nokubeka iliso.
3. Iimfuno zokumisela ijiko lobushushu le-lead-free paste:
3.1 Ukusetwa kwejiko lobushushu kusekwe ikakhulu koku:
Igophe elicetyiswayo elinikezelwe ngumthengisi we-solder paste.
B. PCB sheet impahla, ubukhulu kunye nobukhulu.
C. Ubuninzi kunye nobukhulu bamacandelo, njl.

3.2 Iimfuneko zokuseta iqondo lobushushu elingenalothe:
3.2.1.Iqondo lobushushu lokwenene lilawulwa ukusuka ku-243 ℃ ukuya ku-246 ℃, kwaye akukho BGA kunye ne-QFN IC ngaphakathi kwamabala angama-100, kwaye akukho mveliso enobungakanani bepadi ngaphakathi kwe-3MM.
3.2.2.Kwiimveliso ezinobungakanani be-IC, i-QFN, i-BGA kunye ne-PAD ngaphezu kwe-3MM nangaphantsi kwe-6MM, iqondo lokushisa elilinganisiweyo liya kulawulwa kwi-245-247 degrees.
3.2.3 Kwezinye iimveliso PCB ezikhethekileyo kunye IC, QFN, BGA okanye PCB ibhodi ubukhulu ngaphezu 2MM kunye PAD ubukhulu ngaphezu 6MM, ubushushu obulinganisiweyo peak inokulawulwa ukusuka 247 ukuya 252 degrees ngokweemfuno kanye.
3.2.4 Xa iipleyiti ezikhethekileyo ezifana ne-FPC soft plate kunye ne-aluminium base plate okanye iinxalenye zineemfuno ezikhethekileyo, ziya kulungelelaniswa ngokwemfuno yangempela (imiyalelo yenkqubo yemveliso ikhethekileyo, eya kulawulwa ngokwemiyalelo yenkqubo)
Amagqabantshintshi: Kumsebenzi wokwenene, ukuba kukho nakuphi na ukungaqhelekanga kwiziko, amagcisa e-SMT kunye neenjineli ziya kunika ingxelo ngoko nangoko.3.3 Iimfuno ezisisiseko zejiko lobushushu:
A. Indawo yokufudumala: i-slope preheating yi-1 ~ 3 ℃ / SEC, kwaye ubushushu buphakanyiswe kwi-140 ~ 150 ℃.
B. Ummandla wobushushu rhoqo: 150℃ ~ 200℃, imizuzwana 60 ~ 120
C. Indawo ye-Reflux: ngaphezu kwe-217 ℃ kwi-40 ~ 90 imizuzwana, enexabiso eliphezulu le-230 ~ 255 ℃.
D. Indawo yokupholisa: i-slope yokupholisa ingaphantsi kwe-1 ~ 4 ℃ / SEC (ngaphandle kwe-PPC kunye ne-aluminium substrate, iqondo lokushisa langempela lixhomekeke kwimeko yangempela)