PCBA processing, kwi SMT kunye DIP plug-in soldering, umphezulu amalungu solder iya kuba intsalela ezinye flux rosin, njl. buchaphazela ubomi bemveliso.Intsalela imdaka, ayihambelani neemfuno zokucoceka kwemveliso, ngoko ke i-pcba idinga ukucocwa ngaphambi kokuthunyelwa.Oku kulandelayo kukuthatha ukuba uqonde inkqubo yokuvelisa amanzi pcba ukuhlamba ezinye iingcebiso kunye nezilumkiso.
Nge-miniaturization yeemveliso ze-elektroniki, ukuxinana kwamacandelo e-elektroniki, isithuba esincinci, ukucocwa kuye kwaba nzima ngakumbi, ekukhetheni ukuba yeyiphi inkqubo yokucoca, ngokohlobo lwe-solder paste kunye ne-flux, ukubaluleka kwemveliso, iimfuno zomthengi zokucoca umgangatho. ukukhetha.
I. PCBA iindlela zokucoca
1. Ukucoca amanzi acocekileyo: ukutshiza okanye ukudipha ukuhlamba
Ukucocwa kwamanzi okucacileyo kukusebenzisa amanzi ahlanjululweyo, ukutshiza okanye ukuhlamba idiphu, ikhuselekile ukuyisebenzisa, yomile emva kokucoca, oku kucocwa kuncinci kwaye kukhuselekile, kodwa ezinye izinto eziphangiweyo akulula ukususa.
2. Ukucoca amanzi acocekileyo
Ukucocwa kwe-Semi-water kukusetyenziswa kwe-solvents kunye namanzi adibeneyo, eyongeza ezinye izinto ezisebenzayo, izongezo zokwenza i-agent yokucoca, esi sicoci siqulethe i-solvents ye-organic, i-toxicity ephantsi, ukusetyenziswa kwe-ekhuselekileyo, kodwa ihlanjululwe ngamanzi, kwaye yomile. .
3. Ukucoca nge-ultrasonic
Ukusetyenziswa kwe-ultra-high frequency kwi-liquid medium ibe yi-kinetic energy, ukwakheka kwamaqamza amancinci angenakubalwa abetha umphezulu wento, ukuze umphezulu wokungcola uphume, ukuze kuphunyezwe isiphumo sokucoca ukungcola, kusebenza kakuhle kakhulu. , kodwa nokunciphisa ukuphazamiseka kwe-electromagnetic.
II.Iimfuno zeteknoloji yokucoca i-PCBA
1. I-PCBA i-surface welding components ngaphandle kweemfuno ezikhethekileyo, zonke iimveliso zingasetyenziselwa ukucoca ibhodi ye-PCBA kunye nee-arhente ezikhethekileyo zokucoca.
2. Amanye amacandelo e-elektroniki awavumelekanga ukuba aqhagamshelane ne-ejenti yokucoca ekhethekileyo, njengale: ii-key switches, i-socket yenethiwekhi, i-buzzer, iiseli zebhetri, i-LCD display, i-plastiki components, iilensi, njl.
3. Inkqubo yokucoca, ayikwazi ukusebenzisa i-tweezers kunye nezinye i-metal contact ngqo PCBA, ukuze ungonakalisi ibhodi yebhodi ye-PCBA, i-scratch.
4. I-PCBA emva kokuba i-soldering components, i-flux residue ekuhambeni kwexesha iya kuvelisa i-corrosion physical reaction, kufuneka icocwe ngokukhawuleza.
5. Ukucocwa kwe-PCBA kugqityiwe, kufuneka kufakwe kwi-oven malunga ne-40-50 degrees, emva kwemizuzu engama-30 yokubhaka, uze ususe ibhodi ye-PCBA emva kokumisa.
III.PCBA ukucoca amanyathelo
1. Umphezulu webhodi ye-PCBA awunakuba yintsalela yentsimbi, amaso enkcenkce kunye nentlenga;umphezulu kunye ne-solder joints ayikwazi ukuba ne-white, i-gray phenomenon.
2. Umphezulu webhodi ye-PCBA awunakuncangathi;ukucoca kufuneka ufake i-electrostatic hand ring.
3. I-PCBA kufuneka inxibe imaski ekhuselayo phambi kokucoca.
4. iye yacocwa ibhodi ye-PCBA kwaye ayicocwanga ibhodi yePCBA ibekwe yodwa kwaye imakishwe.
5. Ibhodi yePCBA ecociweyo ayivumelekanga ukuba ichukumise umphezulu ngezandla.
Ixesha lokuposa: Feb-24-2023