Iingongoma eziphambili zeli nqaku
- Iiphakheji ze-BGA zihlangene ngobukhulu kwaye zine-pin ephezulu yoxinaniso.
-Kwiiphakheji ze-BGA, umqondiso we-crosstalk ngenxa yokulungelelaniswa kwebhola kunye nokungahambi kakuhle kuthiwa yi-BGA crosstalk.
-I-BGA crosstalk ixhomekeke kwindawo yomqondiso wokungena kunye nomqondiso wexhoba kuluhlu lwegridi yebhola.
Kumasango amaninzi kunye ne-pin-count ICs, inqanaba lokudibanisa landa ngokukhawuleza.Ezi chips ziye zathembeka ngakumbi, zomelele, kwaye kulula ukuzisebenzisa enkosi kuphuhliso lweepakethe zegridi yebhola (BGA), ezincinci ngobukhulu kunye nobukhulu kwaye zikhulu ngenani lezikhonkwane.Nangona kunjalo, i-BGA crosstalk ichaphazela kakhulu ingqibelelo yesignali, ngaloo ndlela inciphisa ukusetyenziswa kweephakheji ze-BGA.Makhe sixoxe BGA ukupakishwa kunye BGA crosstalk.
Ball Grid Array Packages
Iphakheji ye-BGA yipakethi yokunyuka komphezulu esebenzisa iibhola ezincinci zokuqhuba isinyithi ukunyusa isekethe edibeneyo.Ezi bhola zetsimbi zenza igridi okanye ipateni ye-matrix ehlelwe phantsi kobuso be-chip kwaye ixhunywe kwibhodi yesekethe eprintiweyo.
Uluhlu lwegridi yebhola (BGA) ipakethe
Izixhobo ezipakishwe kwi-BGAs azinazikhonkwane okanye zikhokelela kumda wetshiphu.Endaweni yoko, uluhlu lwegridi yebhola lubekwe ezantsi kwetshiphu.Ezi zintlu zegridi zebhola zibizwa ngokuba ziibhola ze-solder kwaye zisebenza njengezihlanganisi kwiphakheji ye-BGA.
IMicroprocessors, iitshiphusi zeWiFi, kunye neeFPGA zihlala zisebenzisa iipakethe zeBGA.Kwi-chip yephakheji ye-BGA, iibhola ze-solder zivumela ukuba zihambe ngoku phakathi kwe-PCB kunye nephakheji.Ezi bhola ze-solder zixhunywe ngokwenyama kwi-semiconductor substrate ye-electronics.I-lead bonding okanye i-flip-chip isetyenziselwa ukuseka uqhagamshelo lombane kwi-substrate kwaye ufe.Ulungelelwaniso lwe-conductive lubekwe ngaphakathi kwe-substrate evumela ukuba izibonakaliso zombane zidluliselwe ukusuka kumdibaniso phakathi kwe-chip kunye ne-substrate kwi-junction phakathi kwe-substrate kunye noluhlu lwegridi yebhola.
Iphakheji ye-BGA isasaza uxhulumaniso olukhokelela phantsi kwefa kwipatheni ye-matrix.Eli lungiselelo libonelela ngenani elikhulu lokukhokela kwiphakheji ye-BGA kuneepakethe ezisicaba kunye nezimbini.Kwiphakheji ehamba phambili, izikhonkwane zilungiselelwe kwimida.isikhonkwane ngasinye sephakheji ye-BGA sithwala ibhola ye-solder, ebekwe kumphezulu ophantsi we-chip.Olu lungelelwaniso kwindawo ephantsi lunikeza indawo eninzi, okubangela ukuba kubekho izikhonkwane ezininzi, ukuthintela okuncinci, kunye neebhulukhwe ezincinci zokukhokela.Kwiphakheji ye-BGA, iibhola ze-solder zilungelelaniswa kude kunepakethe enezikhokelo.
Izinto eziluncedo kwiiphakheji ze-BGA
Iphakheji ye-BGA inemilinganiselo ehlangeneyo kunye nokuxinana kwe-pin ephezulu.iphakheji ye-BGA ine-inductance ephantsi, evumela ukusetyenziswa kombane ophantsi.Uluhlu lwegridi yebhola lubekwe kakuhle, okwenza kube lula ukulungelelanisa i-chip ye-BGA kunye ne-PCB.
Ezinye iingenelo zepakethe yeBGA zezi:
- Ukutshatyalaliswa kobushushu obuhle ngenxa yokuxhatshazwa kwe-thermal ephantsi kwephakheji.
- Ubude besikhokelo kwiipakethi ze-BGA bufutshane kuneepakethe ezinezikhokelo.Inani eliphezulu leekhokelo ezidityanisiweyo kunye nobukhulu obuncinci benza iphakheji ye-BGA iqhube ngakumbi, ngaloo ndlela iphucula ukusebenza.
- Iiphakheji ze-BGA zibonelela ngentsebenzo ephezulu ngesantya esiphezulu xa kuthelekiswa neepakethe ezisicaba kunye neepakethe eziphindwe kabini zomgca.
- Isantya kunye nesivuno PCB yokuvelisa yonyuka xa usebenzisa izixhobo BGA-zipakishwe.Inkqubo ye-solder iba lula kwaye ilungele ngakumbi, kwaye iipakethe ze-BGA zinokuphinda zenziwe lula.
BGA Crosstalk
Iiphakheji ze-BGA zinezithintelo ezithile: iibhola ze-solder azikwazi ukugoba, ukuhlolwa kunzima ngenxa yoxinano oluphezulu lwepakethe, kunye nokuveliswa kwevolumu ephezulu kufuna ukusetyenziswa kwezixhobo ze-soldering ezibizayo.
Ukunciphisa i-BGA crosstalk, i-low-crosstalk ilungiselelo le-BGA ibaluleke kakhulu.
Iiphakheji ze-BGA zihlala zisetyenziswa kwinani elikhulu lezixhobo ze-I / O.Iimpawu ezithunyelwa kwaye zifunyenwe yi-chip edibeneyo kwi-package ye-BGA inokuphazamiseka ngokudibanisa amandla omqondiso ukusuka kwelinye icala ukuya kwelinye.I-Signal crosstalk ebangelwa ukulungelelaniswa kunye nokungahambi kakuhle kweebhola ze-solder kwiphakheji ye-BGA ibizwa ngokuba yi-BGA crosstalk.I-inductance enomda phakathi koluhlu lwegridi yebhola yenye yezizathu zeziphumo ze-crosstalk kwiiphakheji ze-BGA.Xa i-I / O ephezulu yangoku (izibonakaliso zokungena) zenzeka kwi-package ye-BGA ehamba phambili, i-inductance engapheliyo phakathi kwe-grid arrays ehambelana nomqondiso kunye nezikhonkwane zokubuyisela kudala ukuphazamiseka kwe-voltage kwi-chip substrate.Olu phazamiso lombane lubangela iglitch yesignali ekhutshelwa ngaphandle kwepakethe ye-BGA njengengxolo, ekhokelela kwisiphumo se-crosstalk.
Kwizicelo ezifana neenkqubo zothungelwano ezine-PCB ezishinyeneyo ezisebenzisa imingxunya, iBGA crosstalk inokuqheleka ukuba akukho manyathelo athatyathwayo ukukhusela imingxunya.Kwiisekethe ezinjalo, ixesha elide ngemingxuma ebekwe phantsi kwe-BGA inokubangela ukudibanisa okubalulekileyo kunye nokuvelisa ukuphazamiseka okubonakalayo kwe-crosstalk.
I-BGA crosstalk ixhomekeke kwindawo yomqondiso wokungena kunye nomqondiso wexhoba kuluhlu lwegridi yebhola.Ukunciphisa i-crosstalk ye-BGA, i-low-crosstalk ilungiselelo lephakheji ye-BGA ibalulekile.Nge-software ye-Cadence Allegro Package Designer Plus, abayili banokwandisa i-single-die kunye ne-multi-die wirebond kunye noyilo lwe-flip-chip;i-radial, i-engile epheleleyo yokutyhala-cudisa indlela yokujongana nemiceli mngeni ekhethekileyo yoyilo lwe-BGA/LGA substrate.kunye ne-DRC/DFA ethile ijonga indlela echaneke ngakumbi nesebenzayo.Iitshekhi ezithile ze-DRC/DFM/DFA ziqinisekisa uyilo oluyimpumelelo lwe-BGA/LGA kwipasi enye.Utsalo oluneenkcukacha zoqhagamshelo, imodeli yephakheji ye-3D, kunye nokuthembeka komqondiso kunye nohlalutyo lwe-thermal kunye neempembelelo zobonelelo lwamandla nazo zinikezelwe.
Ixesha lokuposa: Mar-28-2023