Intshayelelo yesikhululo sokuthengisela iBGA
Isikhululo sokuthengisela i-BGAikwabizwa ngokuba yiBGA rework station, nto leyo isisixhobo esikhethekileyo esisetyenziswa kwiitshiphusi zeBGA ezineengxaki zokubethela okanye xa iitshiphusi ezintsha zeBGA kufuneka zitshintshwe.Ekubeni imfuneko yobushushu be-BGA chip welding iphezulu kakhulu, ngoko ke isixhobo sokufudumeza ngokubanzi asikwazi ukuhlangabezana neemfuno zayo.
Itheyibhile ye-solder ye-BGA isebenza kunye nomgangathoreflow ovenigophe, ngoko ke iyasebenza kakhulu ukwenza BGA rework, kwaye izinga lempumelelo linokufikelela ngaphezu kwe 98% ukuba kwenziwa ngetafile engcono yokuthambisa BGA.
Ukuhlelwa kwetafile ye-BGA rework
1. Imodeli yezandla
Xa i-BGA ibekwe kwi-PCB, ixhomekeke kumava omqhubi ukuyincamathisela ngokuhambelana nesakhelo soshicilelo lwekhusi kwi-PCB, efanelekileyo kwi-BGA chip reworking kunye ne-pitch yebhola ye-solder enkulu ye-BGA (ngaphezulu kwe-0.6).Ngaphandle kwejiko lobushushu xa ukufudumeza kuqhutywa ngokuzenzekelayo, yonke eminye imisebenzi ifuna ukusebenza ngesandla.
2. Imodeli yeSemi-automatic
BGA tin ibhola pitch incinci kakhulu (0.15-0.6) chips BGA ngesandla ukuya isiziba ziya kuba neempazamo kwaye ngokulula kubangele ukuwelda embi.Umgaqo wokulungelelaniswa kwamehlo kukusebenzisa inkqubo yemifanekiso yeprism ye-spectroscopic ukukhulisa i-BGA solder joints kunye ne-PCB pads, ukuze imifanekiso yabo eyongeziweyo idibane emva kokuchwetheza ngokuthe nkqo, okuya kuphepha iimpazamo ezenzekayo kwi-patching.Inkqubo yokufudumala iya kuqhuba ngokuzenzekelayo emva kokuba i-patching igqityiwe, kwaye kuya kubakho i-alamu ye-buzzer emva kokuba i-welding igqityiwe.
3. Imodeli ezenzekelayo
Njengoko igama lisitsho, le modeli yinkqubo ezenzekelayo esebenza ngokutsha, esekelwe kumbono womatshini wokulungelelaniswa kobuchwephesha obuphezulu bendlela yokuphumeza inkqubo yokuphinda isebenze ngokuzenzekelayo.
NeoDen BGA Rework station
Unikezelo lwamandla: AC220V±10%, 50/60HZ
Amandla: 5.65KW(Max) ,Ihitha ephezulu(1.45KW)
Isifudumezisi esisezantsi (1.2KW), IR Preheater (2.7KW), Okunye(0.3KW)
Ubungakanani bePCB: 412*370mm(Max);6*6mm(Min)
Ubungakanani be-BGA Chip: 60 * 60mm(Max); 2 * 2mm (Min)
Ubungakanani bokufudumala kwe-IR: 285 * 375mm
Inzwa yobushushu: 1 pcs
Indlela yokuSebenza: 7″ isikrini se-HD esichukumisayo
Inkqubo yokulawula: Inkqubo yokulawula ukufudumeza okuzimeleyo V2 (ilungelo lokushicilela lesoftware)
Inkqubo yokubonisa: 15″ SD isiboniso soshishino (720P isikrini sangaphambili)
Inkqubo yoLungelelaniso: Iimiliyoni ezi-2 zePixel SD inkqubo yokucinga yedijithali, ukusondeza okuzenzekelayo okubonakalayo ngelaser: isalathisi esinechaphaza elibomvu
Vacuum Adsorption: Ngokuzenzekelayo
Ulungelelwaniso oluchanekileyo: ± 0.02mm
Ulawulo lobushushu: K-uhlobo lwe-thermocouple oluvaliweyo-loop ulawulo ngokuchaneka ukuya kuthi ga kwi-±3℃
Isixhobo sokutyisa: Hayi
Indawo: V-groove enendawo yonke
Imilinganiselo: L685 * W633 * H850mm
Ubunzima: 76KG
Ixesha lokuposa: Dec-24-2021