Ukusetyenziswa kweSMT X-reyi umatshini wokuhlola- Uvavanyo lweChips

Injongo kunye nendlela yovavanyo lwetshiphu

Injongo ephambili yokuvavanya i-chip kukubona izinto ezichaphazela umgangatho wemveliso kwinkqubo yokuvelisa ngokukhawuleza kunye nokuthintela ukuveliswa kwe-batch ngaphandle kokunyamezela, ukulungiswa kunye ne-scrap.Le yindlela ebalulekileyo yokulawula umgangatho wemveliso.Itekhnoloji yokuhlola i-X-RAY ene-fluoroscopy yangaphakathi isetyenziselwa uhlolo olungonakalisiyo kwaye ngokuqhelekileyo isetyenziselwa ukufumanisa iziphene ezahlukahlukeneyo kwiipakethe ze-chip, ezifana nokuxobula umaleko, ukugqabhuka, i-voids kunye nokuthembeka kwebhondi.Ukongeza, ukuhlolwa kwe-X-ray okungonakalisiyo kunokukhangela iziphene ezinokuthi zenzeke ngexesha lokwenziwa kwe-PCB, njengokulungelelaniswa okungahambi kakuhle okanye ukuvuleka kwebhulorho, iifutshane okanye ukudibanisa okungaqhelekanga, kunye nokufumanisa ukunyaniseka kweebhola ze-solder kwiphakheji.Ayiboni kuphela i-solder engabonakaliyo, kodwa iphinda ihlalutye iziphumo zokuhlola ngokomgangatho kunye nobungakanani bokufumana iingxaki kwangaphambili.

Umgaqo wokuhlolwa kwe-Chip yeteknoloji ye-X-ray

Isixhobo sokuhlola i-X-RAY sisebenzisa ityhubhu ye-X-reyi ukuvelisa i-X-reyi ngesampulu ye-chip, eqikelelwa kumamkeli womfanekiso.I-imaging yayo ephezulu inokunyuswa ngokucwangcisiweyo ngamaxesha e-1000, ngaloo ndlela ivumela isakhiwo sangaphakathi se-chip ukuba siboniswe ngokucacileyo, ukubonelela ngeendlela ezisebenzayo zokuhlola ukuphucula "isantya esisodwa" kunye nokufezekisa injongo ye "zero". iziphene”.

Ngapha koko, ebusweni bemarike ibonakala iyinyani kodwa ubume bangaphakathi kwezo chips zineziphene, kucacile ukuba azinakwahlulwa ngeliso lenyama.Kuphela phantsi kokuhlolwa kwe-X-ray apho "iprototype" ingabonakaliswa.Ngoko ke, izixhobo zokuvavanya i-X-ray zibonelela ngesiqinisekiso esaneleyo kwaye zidlala indima ebalulekileyo ekuvavanyweni kwee-chips ekuveliseni iimveliso zombane.

Izinto ezilungileyo zePCB x ray machine

1. Ireyithi ye-coverage yeziphene zenkqubo ifikelela kuma-97%.Iziphene ezinokuthi zihlolwe zibandakanya: i-solder yobuxoki, uxhumano lwebhulorho, i-tablet stand, i-solder enganeleyo, imingxuma yomoya, ukuvuza kwesixhobo kunye nokunye.Ngokukodwa, i-X-RAY inokuhlola kwakhona i-BGA, i-CSP kunye nezinye izixhobo ezifihliweyo ezidibeneyo ze-solder.

2. Ukufikelela kuvavanyo oluphezulu.I-X-RAY, izixhobo zokuhlola kwi-SMT, zinokuhlola iindawo ezingenakuhlolwa ngeliso lenyama kunye novavanyo lwe-in-line.Umzekelo, i-PCBA igwetywe iphosakele, kurhanelwa ukuba yi-PCB yangaphakathi yolungelelwaniso lwekhefu, i-X-RAY inokukhangela ngokukhawuleza.

3. Ixesha lokulungiselela uvavanyo lincitshiswe kakhulu.

4. Uyakwazi ukujonga iziphene ezingenakubonwa ngokuthembekileyo ngezinye iindlela zokuvavanya, ezinje: i-solder yobuxoki, imingxuma yomoya kunye nokubumba kakubi.

5. Isixhobo sokuhlola i-X-RAY yeebhodi ezinamacala amabini kunye ne-multilayer kanye kuphela (kunye nomsebenzi we-delamination).

6. Ukubonelela ngolwazi olufanelekileyo lokulinganisa olusetyenziselwa ukuvavanya inkqubo yokuvelisa kwi-SMT.Njengobunzima be-solder paste, inani le-solder phantsi kwe-solder joint, njl.