Wenza ntoni umatshini we-SMT AOI?

SMT AOI MachineInkcazo

Inkqubo ye-AOI yindlela elula yokucinga kunye nenkqubo yokucubungula edibeneyo kunye neekhamera, iilensi, imithombo yokukhanya, iikhomputha kunye nezinye izixhobo eziqhelekileyo.Ngaphantsi kokukhanya komthombo wokukhanya, ikhamera isetyenziselwa ukucinga ngokuthe ngqo, kwaye emva koko ubhaqo lwenziwa ngokulungiswa kwekhompyuter.Iingenelo zale nkqubo elula yindleko ephantsi, ukudibanisa lula, umqobo wobugcisa obuncinci, kwinkqubo yokuvelisa inokutshintsha indawo yokuhlola ngesandla, ukuhlangabezana neemfuno zezihlandlo ezininzi.
 

Ungabekwa phi umatshini we-SMT AOI?

(1) Emva koshicilelo lwe-solder paste.Ukuba inkqubo yokushicilela i-solder paste ihlangabezana neemfuno, inani leziphene ezifunyenwe yi-ICT zinokuncitshiswa kakhulu.Iziphene zoshicilelo eziqhelekileyo ziquka oku kulandelayo:

a.I-solder enganelanga kwiphedi.

b.I-solder eninzi kakhulu kwi-pad.

c.Ukudibana kakubi kwe-solder kwi-pad.

d.Solder ibhulorho phakathi pads.

(2) Ngaphambilireflow oven.Uhlolo lwenziwa emva kokuba amacandelo ancanyathiselwe kuncamatheliso ebhodini naphambi kokuba iPCB ifakwe kwiziko le-reflux.Le yindawo eqhelekileyo yokubeka umatshini wokuhlola, njengoko kulapho uninzi lweziphene ukusuka kushicilelo lwe-solder paste kunye nokubekwa koomatshini kunokufunyanwa.Ulwazi lolawulo lwenkqubo yobungakanani oluveliswe kule ndawo lubonelela ngolwazi lolungelelwaniso koomatshini be-wafer abanesantya esiphezulu kunye nesixhobo sokuxhoma secandelo eliqinileyo.Olu lwazi lungasetyenziselwa ukuguqula ukubekwa kwecandelo okanye ukubonisa ukuba i-laminator idinga ukulinganiswa.Ukuhlolwa kwesi sikhundla kuyanelisa injongo yokulandelwa kwenkqubo.

(3) Emva kwe-welding ye-reflow.Ukuhlolwa ekupheleni kwenkqubo ye-SMT lolona khetho ludumileyo lwe-AOI kuba kulapho zonke iimpazamo zendibano zinokufunyanwa khona.Ukuhlolwa kwe-Post-reflow ibonelela ngenqanaba eliphezulu lokhuseleko kuba lichonga iimpazamo ezibangelwa ukuprintwa kwe-solder paste, ukunyuswa kwecandelo, kunye neenkqubo zokuphinda zivele.
NeoDen SMT AOI Iinkcukacha zoMatshini

Inkqubo yokuhlola Isicelo: emva kokushicilela i-stencil, i-oven yangaphambili / ye-post reflow, i-pre / post wave soldering, i-FPC njl.

Imo yenkqubo: Ukucwangciswa kwe-Manual, inkqubo ye-auto, ukungenisa idatha ye-CAD

Izinto zokuHlola:

I-1) Ukuprintwa kwe-stencil: Ukungafumaneki kwe-solder, ukungonelanga okanye ukugqithiswa kwe-solder, ukungahambi kakuhle kwe-solder, i-bridging, ibala, i-scratch njl.

I-2) Isiphene secandelo: icandelo elilahlekileyo okanye eligqithisileyo, ukungahambi kakuhle, ukungalingani, ukulinganisa, ukunyuka okuchaseneyo, icandelo elingalunganga okanye elibi njl.

3) I-DIP: Amalungu alahlekileyo, iindawo zomonakalo, i-offset, i-skew, i-inversion, njl

I-4) I-soldering defect: i-solder egqithisileyo okanye elahlekileyo, i-solder engenanto, i-bridging, ibhola ye-solder, i-IC NG, ibala lobhedu njl.