Yintoni i-AOI

Yintoni iteknoloji yokuvavanya i-AOI

I-AOI luhlobo olutsha lovavanyo lobuchwephesha obunyuka ngokukhawuleza kule minyaka yakutsha nje.Okwangoku, abavelisi abaninzi baqalise izixhobo zovavanyo ze-AOI.Xa ubhaqa ngokuzenzekelayo, umatshini uhlola ngokuzenzekelayo i-PCB ngekhamera, uqokelela imifanekiso, uthelekisa amalunga avavanyiweyo e-solder kunye neeparamitha ezifanelekileyo kwisiseko sedatha, ujonga iziphene kwi-PCB emva kokulungiswa komfanekiso, kwaye ubonise / uphawula iziphene kwi-PCB ngokusebenzisa. isibonisi okanye uphawu oluzenzekelayo lokulungiswa kwabasebenzi.

1. Iinjongo zokuphunyezwa: ukuphunyezwa kwe-AOI kunezi ndidi zimbini zeenjongo zilandelayo:

(1) Ukugqiba umgangatho.Jonga imeko yokugqibela yeemveliso xa ziphuma kumgca wemveliso.Xa ingxaki yokuvelisa icacile kakhulu, umxube wemveliso uphezulu, kwaye ubuninzi kunye nesantya zizinto eziphambili, le njongo ikhethwayo.I-AOI idla ngokubekwa ekupheleni komgca wemveliso.Kule ndawo, izixhobo zinokuvelisa uluhlu olubanzi lweenkcukacha zolawulo lwenkqubo.

(2) Ukulandelela inkqubo.Sebenzisa izixhobo zokuhlola ukujonga inkqubo yemveliso.Ngokuqhelekileyo, ibandakanya ulwahlulo oluneenkcukacha lweziphene kunye nolwazi lokubekwa kwecandelo.Xa ukuthembeka kwemveliso kubalulekile, imveliso ephantsi yomxube ophantsi, kunye nokubonelela ngecandelo elizinzile, abavelisi banikela kuqala kule njongo.Oku kudla ngokufuna ukuba izixhobo zokuhlola zibekwe kwiindawo ezininzi kumgca wemveliso ukujonga imeko ethile yemveliso kwi-intanethi kunye nokubonelela ngesiseko esiyimfuneko sokulungelelaniswa kwenkqubo yokuvelisa.

2. Indawo yokubeka

Nangona i-AOI ingasetyenziselwa kwiindawo ezininzi kumgca wemveliso, indawo nganye inokubona iziphene ezikhethekileyo, izixhobo zokuhlola i-AOI kufuneka zibekwe kwindawo apho uninzi lweziphene lunokuchongwa kwaye lulungiswe ngokukhawuleza.Kukho iindawo ezintathu eziphambili zokuhlola:

(1) Emva kokuba intlama ishicilelwe.Ukuba inkqubo yokushicilela i-solder paste ihlangabezana neemfuno, inani leziphene ezifunyenwe yi-ICT zinokuncitshiswa kakhulu.Iziphene zoshicilelo eziqhelekileyo ziquka oku kulandelayo:

A. I-solder enganelanga kwi-pad.

B. Kukho i-solder eninzi kakhulu kwiphedi.

C. Ukudibana phakathi kwe-solder kunye ne-pad kubi.

D. Solder ibhulorho phakathi pads.

Kwi-ICT, ukuba nokwenzeka kweziphene ngokubhekiselele kwezi meko kuhambelana ngokuthe ngqo nobunzima bemeko.Isixa esincinci setoti asifane sikhokhelele kwiziphene, ngelixa iimeko ezinzima, ezinje ngokungabikho kwetoti konke konke, phantse zisoloko zibangela iziphene kwi-ICT.I-solder enganelanga inokuba yenye yezizathu zamacandelo alahlekileyo okanye i-solder evulekileyo.Nangona kunjalo, ukwenza isigqibo sokuba ibekwe phi i-AOI kufuna ukuqaphela ukuba inxalenye yelahleko inokuba ngenxa yezinye izizathu ekufuneka zibandakanywe kwisicwangciso sohlolo.Ukujonga kule ndawo kuxhasa ngokuthe ngqo ukulandelwa kwenkqubo kunye nophawu.Idatha yolawulo lwenkqubo yobungakanani kweli nqanaba ibandakanya i-offset yokushicilela kunye nolwazi lobungakanani be-solder, kunye nolwazi olusemgangathweni malunga ne-solder eprintiweyo nayo yenziwe.

(2) Phambi kwe-reflow soldering.Ukuhlolwa kugqitywe emva kokuba amacandelo afakwe kwi-solder paste ebhodini kwaye ngaphambi kokuba i-PCB ithunyelwe kwi-oven reflow.Le yindawo eqhelekileyo yokubeka umatshini wokuhlola, njengoko uninzi lweziphene ukusuka kushicilelo lokuncamathelisa kunye nokubekwa koomatshini kunokufumaneka apha.Ulwazi lolawulo lwenkqubo yobungakanani oluveliswe kule ndawo lubonelela ngolwazi lolungelelwaniso koomatshini befilimu abanesantya esiphezulu kunye nezixhobo zokuxhoma izinto ezivaliweyo.Olu lwazi lungasetyenziselwa ukulungisa ukubekwa kwecandelo okanye ukubonisa ukuba isixhomi sifuna ukulinganiswa.Ukuhlolwa kwale ndawo kuhlangabezana nenjongo yokulandelwa kwenkqubo.

(3) Emva kwe-reflow soldering.Ukujonga kwinqanaba lokugqibela lenkqubo ye-SMT lolona khetho ludumileyo lwe-AOI okwangoku, kuba le ndawo inokubona zonke iimpazamo zendibano.Ukuhlolwa kwe-Post reflow ibonelela ngenqanaba eliphezulu lokhuseleko kuba lichonga iimpazamo ezibangelwa ukuncamathelisa ukuprinta, ukubekwa kwecandelo, kunye neenkqubo zokuphinda uqukunjelwe.