I. Ukuhlelwa komatshini we-SPI
Umatshini wokuhlola i-Solder pasteinokwahlulwa ibe yi-2D yokulinganisa kunye ne-3D yokulinganisa.
1. Umatshini wokuhlola we-solder we-2D unokulinganisa kuphela ukuphakama kwendawo ethile kwi-solder paste, i-3D SPI inokulinganisa ukuphakama kwe-solder paste ye-pad yonke, ngakumbi kunokubonakalisa ubukhulu bokwenene be-solder paste.Ukongeza ekubaleni ukuphakama, unokuphinda ubale indawo yokunamathisela i-solder kunye nomthamo
2. 2D solder paste ukutyeba umvavanyi manual egxile, impazamo yomntu inkulu.Ubungakanani be-3D yegeyiji yekhompyuter ugqaliselo oluzenzekelayo, idatha yobungakanani obulinganisiweyo ichaneke ngakumbi.
II.Inkcazo yomatshini weNeoDen SPI
1. Inkqubo yesoftware:
Inkqubo yokusebenza: Windows 7 Ultimate 64bit
1) Inkqubo yokuchonga:
Uphawu:Ikhamera ye-raster ye-3d (i-double iyakhethwa)
Ujongano olusebenzayo:Inkqubo yomzobo, kulula ukuyisebenzisa, inkqubo yesiTshayina nesiNgesi tshintsha
Ujongano: 2D KUNYE kunye nomfanekiso we-3D truecolor
AMANQAKU: Ungakhetha inqaku eli-2 lecommom
I-2) Inkqubo: Inkxaso ye-gerber, igalelo le-CAD, i-offline kunye neprogram yencwadana
3) SPC
I-SPC engaxhunyiwe kwi-intanethi: Inkxaso
Ingxelo ye-SPC: Nanini na iNgxelo
Control Graphic: Umthamo, indawo, ukuphakama, offset
Thumela umxholo: Excel, umfanekiso (jpg, bmp)
2. Inkqubo yokulawula
1) Umamkeli: IPC yokulawula ishishini, intel 6 core CPU, 16GDDR, 1T
2) Isibonisi: 22 intshi lcd ebanzi bonisa
III.Umgaqo weSPI
Umgaqo wokufumanisa we-SPI ngokusisiseko ufana ne-AOI, esebenzisa umfanekiso obonakalayo ukujonga umgangatho.I-solder paste ihlola i-flatness, ubukhulu kunye ne-offset ye-solder paste, ngoko ke kuyimfuneko ukufumanisa ibhodi ye-OK njengesampuli, kwaye ibhodi ye-PCB eprintiweyo kwibhetshi iya kugwetywa ngokwebhodi ye-OK.Kusenokubakho iziphene ezininzi ekuqaleni, kodwa oku kuqhelekile kuba umatshini kufuneka ufunde kwaye uguqule iiparamitha kunye neenjineli ukuyigcina.
Ixesha lokuposa: Nov-02-2021