Yintoni Inkqubo yeSPI?

Ukusetyenzwa kwe-SMD yinkqubo yovavanyo olungenakuphepheka, i-SPI (uHlolo lwe-Solder Paste) yinkqubo yokucubungula i-SMD yinkqubo yokuvavanya, esetyenziselwa ukufumanisa umgangatho we-solder paste yokushicilela okulungileyo okanye okubi.Kutheni ufuna izixhobo ze-spi emva kokuprintwa kwe-solder paste?Ngenxa yokuba idatha evela kushishino malunga ne-60% yomgangatho we-solder ngenxa yokushicilela i-solder paste engalunganga (ezinye zinokunxulumana ne-patch, inkqubo yokubuyisela kwakhona).

I-SPI kukufumanisa ukuprinta kwe-solder embi,Umatshini we-SMT SPIibekwe ngasemva kumatshini wokushicilela we-solder paste, xa i-solder paste emva kokushicilela isiqwenga se-pcb, ngokudityaniswa kwetafile yokuhambisa kwisixhobo sovavanyo lwe-SPI ukubona umgangatho wayo wokushicilela ohambelanayo.

ISPI inokubona ukuba yeyiphi imiba embi?

1. Ingaba i-solder paste iyitoti

I-SPI inokubona ukuba i-solder incamathelise umatshini wokushicilela itoti yoshicilelo, ukuba i-pcb iipads ezikufutshane netoti, iya kukhokelela ngokulula kwisekethe emfutshane.

2. Ncamathelisa i-offset

I-solder paste i-offset ithetha ukuba ushicilelo lwe-solder uncamathiselelo aluprintwa kwi-pcb pads (okanye inxalenye kuphela ye-solder paste eprintwe kwi-pads), i-solder paste yokushicilela i-offset inokukhokelela kwi-solder engenanto okanye ilitye lesikhumbuzo kunye nobunye umgangatho ombi.

3. Khangela ubukhulu be-solder paste

I-SPI ibona ubukhulu be-solder paste, ngamanye amaxesha inani le-solder paste lininzi kakhulu, ngamanye amaxesha inani le-solder paste lincinci, le meko iya kubangela i-welding soldering okanye i-welding engenanto.

4. Ukukhangela ukucaca kwe-solder paste

I-SPI ibona ukunyameka kwe-solder paste, kuba umatshini wokushicilela we-solder uya kudilizwa emva kokushicilela, ezinye ziya kubonakala zidonsa i-tip, xa i-flatness ayifani ngexesha elifanayo, kulula ukubangela iingxaki zomgangatho we-welding.

I-SPI ibona njani umgangatho woshicilelo?

I-SPI sesinye sezixhobo zomtshini wokubona, kodwa kwakhona ngokusebenzisa i-algorithms yenkqubo yamehlo kunye nekhompyuter ukugqibezela umgaqo wokubhaqwa, ukuprintwa kwe-solder paste, spilela kwilensi yekhamera yangaphakathi kumphezulu wekhamera ukukhupha idatha, kwaye ke ukuqondwa kwe-algorithm yenziwe umfanekiso ubhaqo, kwaye ke nge data isampuli ok uthelekiso, xa kuthelekiswa ok ukuya kumgangatho iya kumiselwa njengebhodi elungileyo, xa kuthelekiswa ok ayikhutshelwa alarm, amagcisa inokuba amaGcisa unako ukususa ngokuthe ngqo enesiphene. iibhodi ezivela kwibhanti yokuhambisa

Kutheni ukuhlolwa kwe-SPI kuya kuthandwa ngakumbi?

Kukhankanywe nje ukuba amathuba okuwelda kakubi ngenxa yoshicilelo lwe-solder paste ebangelwa ngaphezu kwe-60%, ukuba kungekhona emva kovavanyo lwe-spi ukumisela okubi, kuya kuba ngqo emva kwe-patch, inkqubo ye-reflow soldering, xa ukugqitywa kwe-welding kwaye emva koko emva kwe-aoi. uvavanyo lufunyenwe kakubi, kwelinye icala, ukugcinwa kweqondo lengxaki kuya kuba kubi ngaphezu kwe-spi ukumisela ixesha lenkathazo embi (i-SPI isigwebo soshicilelo olubi, ngokuthe ngqo ukusuka kwibhanti yokuhambisa ukuba ithathe phantsi, uhlambe i-paste) , Ngakolunye uhlangothi, emva kwe-welding, ibhodi embi ingasetyenziselwa kwakhona, kwaye emva kwe-welding, uchwepheshe unokuthatha ngokuthe ngqo ibhodi embi kwibhanti yokuhambisa.Ingaphinda isetyenziswe kwakhona), ukongeza kugcino lwewelding kuya kubangela inkcitho eninzi yabasebenzi, imathiriyeli kunye nemithombo yemali.