1.Imeko yokugcinwa kwe-solder paste
Uncamathiselo lwesolda kufuneka lufakwe kwi-SMT patch processing.Ukuba i-solder paste ayisetyenziswanga ngokukhawuleza, kufuneka ibekwe kwindawo yendalo ye-5-10 degrees, kwaye iqondo lokushisa akufanele libe ngaphantsi kwe-0 degrees okanye ngaphezulu kwe-10 degrees.
2.Ukugcinwa kwemihla ngemihla kwe Umatshini we-SMT
SMTkhetha kwaye ubeke umatshini ukuba zigcinwe ngexesha, ukuphucula imithetho kunye nemimiselo yokuhlolwa kwendawo yezixhobo.Ukuba kukho i-embrittlement yomatshini kunye nezixhobo, okanye ukutshatyalaliswa kwamacandelo, kuya kuba ne-SMT sticking slanting, ukuphosa okuphezulu kunye nochungechunge lweemeko, ezichaphazela kakhulu imveliso kunye nokuveliswa.
3. Ukuphuculwa kunye nokusetwa kweeparamitha eziphambili zokusetyenzwa
Ukuqinisekisa umgangatho welding yebhodi PCB, kufuneka sisoloko ingqalelophinda uqukunjelwei-oveniiparameters processing ziyasebenza.Ngokuqhelekileyo, ulawulo lobushushu kufuneka luvavanywe kabini ngosuku.Kuphela ngokuphucula rhoqo ijika leqondo lokushisa apho umgangatho weemveliso eziveliswayo kunye nokucutshungulwa ukuqinisekiswa.
4.Ukuphakamisa indlela yokuvavanya
Ngenxa yobume obuntsonkothileyo kunye neteknoloji yokucubungula yamacandelo e-elektroniki, itekhnoloji yokuvavanya engonakalisi ibekwe phambili iimfuno eziphezulu kakhulu.Iindlela zokuhlola ezisisiseko, kubandakanywa nokuhlola okubonakalayo, AOIumatshini, I-ICT kunye novavanyo lwe-ultrasonic, ixesha elide alikwazanga ukuhlangabezana neemfuno zoxinaniso oluhambelanayo, ukusebenza ngokufanelekileyo kunye nomgangatho kwi-FIELD ye-SMT.Indlela yokufumanisa i-X-ray lolona khetho lungcono lokuphucula umgangatho wokubona kunye nomgangatho wemveliso ngoku.Ngasentla yinkqubo ye-SMT patch processing ukunikela ingqalelo kumanqaku aphambili, uyazazi ezi?
Ukuba ufuna nasiphi na isixhobo somgca wemveliso ye-SMT, nceda uzive ukhululekile ukuqhagamshelana nathi.
Ixesha lokuposa: Dec-23-2020