1. Amacandelo asemgangathweni kufuneka athathele ingqalelo ukunyamezela ubungakanani bamacandelo abavelisi ahlukeneyo, amacandelo angengawo asemgangathweni kufuneka ayilwe ngokungqinelana nobukhulu becandelo lemizobo yeepad kunye nesithuba sepad.
2. Uyilo lwesekethe ephezulu yokuthembeka kufuneka yandiswe ukusetyenzwa kwepleyiti ye-solder, ububanzi bephedi = 1.1 ukuya ku-1.2 ububanzi bamacandelo ekupheleni kwe-solder.
3. Uyilo olunoxinano oluphezulu kwilayibrari yesoftware yamacandelo ukulungisa ubungakanani bepadi.
4. Umgama phakathi kwamacandelo ahlukeneyo, iingcingo, amanqaku okuvavanya, i- through-hole , i-pads kunye ne-wire connections, i-solder resistance, njl njl. kufuneka yenziwe ngokuhambelana neenkqubo ezahlukeneyo.
5. Qwalasela ukusetyenzwa kwakhona.
6. Qwalasela ukutshatyalaliswa kobushushu, amaza aphezulu, uphazamiseko lwe-anti-electromagnetic kunye neminye imiba.
7. ukubekwa kwamacandelo kunye nolwalathiso kufuneka luyilwe ngokuhambelana neemfuno zenkqubo ye-reflow okanye i-wave soldering process.Umzekelo, xa usebenzisa inkqubo ye-reflow soldering, isalathiso soyilo lwamacandelo ukuqwalasela isalathiso sePCB kwi-oven reflow.Xa usebenzisa umatshini we-wave soldering, umphezulu womatshini awunakubekwa i-PLCC, i-FP, izihlanganisi kunye namacandelo amakhulu e-SOIC;ukuze kuncitshiswe isiphumo sesithunzi samaza, ukuphucula umgangatho we-welding, uyilo lwamacandelo ahlukeneyo kunye nendawo yeemfuno ezizodwa;Uyilo lwemizobo ye-soldering pad, izinto ezixande, iSOT, iSOP ubude bepad kufuneka kwandiswe ukujongana neeperile ezimbini ezingaphandle zeSOP ebanzi yeepadi ze-solder ukuthengisa i-solder engaphezulu, ngaphantsi kwe-3.2mm × 1.6mm izinto ezixande, zinokukhutshelwa kuzo zombini iziphelo pad 45 ° processing, njalo njalo.
8. Uyilo lwebhodi yesekethe eprintiweyo nayo ithathela ingqalelo izixhobo.Ezahlukeneyo umatshini onyukayo isakhiwo mechanical, ulungelelwaniso, eprintiweyo ibhodi yesekethe transmission zahlukile, ngoko ke indawo eprintiweyo ibhodi yesekethe umngxuma indawo, uphawu benchmark (uphawu) yemizobo kunye nendawo, eprintiweyo ibhodi yesekethe edge imilo, kwakunye emphethweni ibhodi yesekethe eprintiweyo kufutshane. indawo yamacandelo ayinakubekwa ineemfuno ezahlukeneyo.Ukuba inkqubo ye-wave soldering isetyenzisiwe, kuyafuneka ukuba kuqwalaselwe umgca wenkqubo yebhodi yesekethe eprintiweyo yokuhambisa ikhonkco kufuneka ishiywe.
9. Kodwa kwakhona qwalasela amaxwebhu oyilo ahambelanayo.
10. ukunciphisa iindleko zemveliso phantsi kwesiseko sokuqinisekisa ukuthembeka.
11. uyilo lwebhodi yesekethe eprintiweyo efanayo, ukusetyenziswa kweeyunithi kufuneka kuhambelane.
12. Udibaniso olunamacala amabini kunye nendibano enye yeemfuno zoyilo lwebhodi yesekethe eprintiweyo ziyafana
13. Kodwa kwakhona qwalasela amaxwebhu oyilo ahambelanayo.
Ixesha lokuposa: Mar-10-2022