Kuyakwenzeka ntoni ukuba izinto zePCB kunye nobungakanani abufanelekanga?

1. Ngokwemiqathango ye-GJB3835, emva kwe-warping kunye ne-deformation welding ye-PCBAreflow oveninkqubo welding, warping ubuninzi kunye nokugqwethwa akayi kudlula 0.75%, kunye warping kunye nokugqwethwa PCB kunye amacandelo fayini-isithuba akayi kudlula 0.5%.
2. PCBA nge warping ecacileyo, ukuba multi- umaleko PCBA deformation uxinzelelo, kubandakanywa ukomelezwa ufakelo isakhelo metal, chassis iqonga ufakelo Screw, chassis guide umzila kaloliwe ufakelo kunye nolunye ufakelo deformation umva (ukufakwa), kusenokwenzeka ukuba kubangele. umonakalo okanye ukwaphuka kwimingxuma metallization of iingcingo eziprintiweyo ezifana noxinaniso oluphezulu IC kunye namanye amacandelo akhokelela, BGA / CCGA solder joints kunye nemingxuma relay of multilayer PCB.

3. I-PCBA ngokuphazamiseka okanye ukugoba ukuya kwi-0.75% iya kufakwa ngokuhambelana nezi zibonelelo zilandelayo ukuba kuqinisekiswe ukuba uxinzelelo lwe-deformation alubangeli umonakalo wecandelo kunye neengxaki zokuthembeka kwaye kufuneka ziqhubeke zisetyenziswa.
Faka (faka) kunye ne-screw fastening ngokuthe ngqo kwiqonga le-chassis, i-groove yesikhokelo, umzila wesikhokelo okanye intsika akufanele iqhutywe ukuphepha umonakalo ongaphezulu kumacandelo kunye nemingxuma enesinyithi ebangelwa ukunyanzeliswa kokuguqulwa kokuguqulwa kofakelo lwendibano yePCB.
Amanyathelo okulala asekuhlaleni (izixhobo zombane okanye i-thermal conductive) ziya kuthathwa kwindawo apho i-distortion and bending deformation gap iyona nkulu, ngaphandle kokuchaphazela ukuthembeka kofakelo kunye nokuqinisekisa iziteshi eziphambili ze-thermal okanye zokuqhuba.Inxalenye ye-warping ingafakelwa kwaye iboshwe kuphela phantsi komqathango wokuba indibano yebhodi yesiphaluka ekhubazekileyo ayithwali umva woxinzelelo lwe-deformation.

4. Ukuqina kunye nokuguqulwa kwamandla ezinto ezikhethiweyo kwisakhiwo sofakelo lwe-PCB kunye nesakhelo sokuqinisa akuyi kubangela ukuphazamiseka okanye ukuguqulwa kwesaphetha okanye ukuguqula ukuguqulwa kwe-PCB.

5. Kwi-PCBA ye-multilayer ngokuphambuka okucacileyo okanye ukugoba, okanye ukugqwesa (ukugoba) ngaphantsi kwe-0.75%, ngakumbi i-PCBA exhotyiswe nge-IC ephezulu, i-BGA / CCGA, ukulungiswa okanye ukufakwa kwe-anti-deformation ye-PCB kufuneka kuthintelwe ngokungqongqo. .