Injongo yokupakishwa kwe-semiconductor chip kukukhusela i-chip ngokwayo kunye nokudibanisa imiqondiso phakathi kweetshiphusi.Kwixesha elide elidlulileyo, ukuphuculwa komsebenzi we-chip ikakhulu kuxhomekeke ekuphuculweni koyilo kunye nenkqubo yokuvelisa.
Nangona kunjalo, njengoko isakhiwo se-transistor se-semiconductor chips singena kwixesha le-FinFET, inkqubela phambili yenkqubo yenkqubo ibonise ukucotha okukhulu kwimeko.Nangona ngokwendlela yophuhliso loshishino, kusekho indawo eninzi yokuphindaphinda inkqubo ye-node ukunyuka, sinokuziva ngokucacileyo ukucotha koMthetho kaMoore, kunye noxinzelelo oluziswa kukunyuka kweendleko zemveliso.
Ngenxa yoko, iye yaba yindlela ebaluleke kakhulu yokuphonononga ngakumbi amandla okuphucula ukusebenza ngokuguqula iteknoloji yokupakisha.Kwiminyaka embalwa edlulileyo, ishishini liye lavela ngokusebenzisa iteknoloji yokupakisha phambili ukuqonda isiqubulo esithi "ngaphaya kweMoore (Ngaphezu kweMoore)"!
Okubizwa ngokuba yi-packaging ehamba phambili, inkcazo eqhelekileyo yoshishino jikelele kukuba: konke ukusetyenziswa kweendlela zenkqubo yokuvelisa i-front-channel ye-teknoloji yokupakisha.
Ngokupakishwa kwangaphambili, singakwazi:
1. Ukunciphisa ngokuphawulekayo indawo ye-chip emva kokupakishwa
Nokuba yindibaniselwano yeetshiphusi ezininzi, okanye iphakheji enye ye-Wafer Levelization, inokunciphisa kakhulu ubungakanani bepakethe ukwenzela ukunciphisa ukusetyenziswa kwendawo yonke yebhodi yenkqubo.Ukusetyenziswa kokupakisha kuthetha ukunciphisa indawo ye-chip kuqoqosho kunokuphucula inkqubo ye-front-end ukuba ibe neendleko eziphezulu.
2. Yamkela amazibuko e-chip I/O ngakumbi
Ngenxa yokuqaliswa kwenkqubo yesiphelo sangaphambili, sinokusebenzisa iteknoloji ye-RDL ukulungiselela izikhonkwane ezininzi ze-I / O kwindawo yeyunithi ye-chip, ngaloo ndlela sinciphisa inkunkuma yendawo ye-chip.
3. Ukunciphisa iindleko zokwenziwa kwetshiphu zizonke
Ngenxa yokuqaliswa kweChiplet, sinokudibanisa ngokulula iichips ezininzi kunye nemisebenzi eyahlukeneyo kunye nobuchwepheshe benkqubo / iinodi ukwenza inkqubo-kwi-package (SIP).Oku kunqanda indlela ebizayo yokuba kusetyenziswe enye (inkqubo ephezulu) kuyo yonke imisebenzi kunye nee-IP.
4. Ukwandisa uqhagamshelwano phakathi kweetshiphusi
Njengoko imfuno yamandla amakhulu ekhompyutheni isanda, kwiimeko ezininzi zokusetyenziswa kuyimfuneko kwiyunithi yekhompyutha (CPU, GPU ...) kunye ne-DRAM ukwenza utshintshiselwano oluninzi lwedatha.Oku kudla ngokukhokelela ekubeni phantse isiqingatha sokusebenza kunye nokusetyenziswa kwamandla enkqubo yonke kuchithwa kunxibelelwano lolwazi.Ngoku ukuba sinokunciphisa le lahleko ukuya ngaphantsi kwe-20% ngokudibanisa iprosesa kunye ne-DRAM ngokusondeleyo ngokusemandleni ngokusebenzisa iiphakheji ezahlukeneyo ze-2.5D / 3D, sinokunciphisa kakhulu iindleko zekhompyutha.Oku kwanda kokusebenza ngokufanelekileyo kodlula lee inkqubela eyenziweyo ngokwamkelwa kweenkqubo zokuvelisa ezikumgangatho ophezulu
I-Zhejiang NeoDen Technology Co., LTD., yasekwa ngo-2010 kunye nabasebenzi abayi-100+ kunye ne-8000+ Sq.m.umzi-mveliso wamalungelo epropathi azimeleyo, ukuqinisekisa ulawulo olusemgangathweni nokuphumeza ezona ziphumo zininzi zoqoqosho kunye nokugcina iindleko.
Uneziko lomatshini, umdibanisi onezakhono, umvavanyi kunye neenjineli ze-QC, ukuqinisekisa ubuchule obuqinileyo bokwenza oomatshini beNeoDen, umgangatho kunye nokuhanjiswa.
Izakhono kunye nenkxaso yesiNgesi yobuchwephesha kunye neenjineli zenkonzo, ukuqinisekisa impendulo ekhawulezileyo kwiiyure ezisi-8, isisombululo sibonelela ngeeyure ezingama-24.
Eyodwa phakathi kwabo bonke abavelisi baseTshayina ababhalise kwaye bavunywa i-CE yiTUV NORD.
Ixesha lokuposa: Sep-22-2023