SMT reflow ovensisixhobo sokuthengisa esiyimfuneko kwinkqubo ye-SMT, eneneni indibaniselwano ye-oven yokubhaka.Umsebenzi wayo oyintloko kukuvumela i-solder yokunamathisela kwi-oven yokubuyisela kwakhona, i-solder iya kunyibilika kumaqondo aphezulu emva kokuba i-solder ikwazi ukwenza amacandelo e-SMD kunye neebhodi zeesekethe kunye kwisixhobo sokudibanisa.Ngaphandle kwezixhobo ze-SMT zokuphinda zifakwe kwi-soldering inkqubo ye-SMT ayinakwenzeka ukugqiba ukuze amacandelo e-elektroniki kunye nebhodi yesekethe isebenze.Kwaye i-SMT phezu kwetreyi ye-oveni sesona sixhobo sibaluleke kakhulu xa imveliso ingaphezulu kwe-soldering ephinda-phinda, jonga apha unokuba nemibuzo: SMT phezu kwetreyi ye-oveni yintoni?Yintoni injongo yokusebenzisa iitreyi ezigqithisiweyo ze-SMT okanye abathwali be-overbake?Nantsi ukujonga ukuba yintoni kanye kanye i-SMT overbake tray.
1. Yintoni i-SMT overbake tray?
Into ebizwa ngokuba yi-SMT over-burner tray okanye i-carrier over-burner carrier, eqinisweni, isetyenziselwa ukubamba i-PCB kwaye emva koko iyise ngasemva kwi-tray ye-soldering furnace okanye i-carrier.Umthuthi wetreyi udla ngokuba nekholamu yokumisa esetyenziselwa ukulungisa iPCB ukuyithintela ekusebenzeni okanye ekujikeni, ezinye zetrayi ephathwayo ziyakongeza isigqubuthelo, ngokwesiqhelo kwiFPC, kwaye zifakele imagnethi, khuphela isixhobo xa ikomityi yokufunxa iqinisa. nge, ngoko SMT chip processing plant inokuphepha PCB deformation.
2. Ukusetyenziswa kwe-SMT phezu kwetreyi ye-oven okanye ngaphezulu kwenjongo ye-oven carrier
Ukuveliswa kwe-SMT xa usebenzisa phezu kwe-oven tray kukunciphisa i-PCB deformation kunye nokuthintela iindawo ezingaphezulu kwe-overweight, zombini ezo zombini zihambelana ne-SMT emva kwindawo yokushisa ephezulu yesithando somlilo, kuninzi lweemveliso ngoku usebenzisa inkqubo yokukhokela. , I-SAC305 i-solder intlama intlama intlama etyhidiweyo ubushushu obutyhidiweyo be-217 ℃, kunye ne-SAC0307 intlama ye-solder intlama ubushushu obutyhidiweyo buwa malunga ne-217 ℃ ~ 225 ℃, olona bushushu liphezulu libuyela kwi-solder ngokubanzi Kucetyiswa phakathi kwe-240 ~ 250 ℃. , sikhetha ngokubanzi ipleyiti yeFR4 ye-Tg150 ngasentla.Oko kukuthi, xa i-PCB ingena kwindawo yobushushu obuphezulu beziko le-soldering, eneneni, sele idlulile ixesha elide lobushushu bokudlulisa iglasi kwimo yerabha, imeko yerabha yePCB iya kukhubazeka kuphela ukubonisa iimpawu zayo eziphathekayo nje. kunene.
Idityaniswe nokucuthwa kobukhulu bebhodi, ukusuka kubukhulu obuqhelekileyo be-1.6mm ukuya kuthi ga kwi-0.8mm, kunye ne-0.4mm PCB, ibhodi yesekethe ecekethekileyo kubhaptizo lobushushu obuphezulu emva komlilo ovuthayo, kulula ngenxa yokuphakama okuphezulu. ubushushu kunye nengxaki deformation ibhodi.
SMT phezu kwetreyi ye-oveni okanye ngaphezulu kwesiphathi se-oveni kukoyisa i-deformation ye-PCB kunye neenxalenye eziwela iingxaki kwaye zivela, ngokuqhelekileyo isebenzisa intsika yokumisa ukulungisa umngxuma wokumisa we-PCB, kwipleyiti yokuguqulwa kobushushu obuphezulu ukugcina ngokufanelekileyo imilo yePCB. ukunciphisa deformation ipleyiti, kunjalo, kufuneka kubekho nezinye imivalo ukunceda indawo ephakathi ipleyiti ngenxa yempembelelo yomxhuzulane inokugoba ingxaki ukuzika.
Ukongeza, ungasebenzisa kwakhona umthwali ogqithisiweyo akukho lula ukukhubaza iimpawu zoyilo lweembambo okanye iingongoma zenkxaso ezingezantsi kwiindawo ezityebileyo ukuqinisekisa ukuba iinxalenye aziwi ingxaki, kodwa ukuyila kwesi sithwala kufuneka kube kakhulu. ngononophelo ukuphepha amanqaku enkxaso ngokugqithisileyo ukuphakamisa iindawo ezibangelwa licala lesibini lokungachaneki kwengxaki yoshicilelo lwe-solder paste.
Ixesha lokuposa: Apr-06-2022