Kutheni i-capacitor iya kuma ilitye lesikhumbuzo solder lobuxoki?

1.Ingxaki yoshicilelo lwe-solder paste
Ngexesha loshicilelo lwe-solder paste yokuprinta, ngenxa yokuba i-solder paste yoshicilelo ayisicaba, isiphelo esinye sobuninzi be-solder paste singaphezulu, ubuninzi be-solder paste bokugqibela buncinci, bukhokelelaphinda uqukunjelwei-oveniI-soldering eshushu iyanyibilika ibonakala ixesha elingahambelani, ubungakanani boxinzelelo alulingani, enye isiphelo sokuqala i-warp.
2.Khetha kwaye ubekeumatshiniindawo ethambekileyo okanye engacacanga
Umatshini we-SMD uthambeka okanye ungachanekanga, indawo yokubeka ipleyiti ye-solder ibonakala enye indawo yokufuduswa ngaphezulu, ikhokelela kwixesha elishushu lokunyibilika, elinye isiphelo esishushu sinyibilike ngokukhawuleza, esinye isiphelo asikanyibiliki, ukubonakala koxinzelelo ngokwahlukileyo, isiphelo esinye sijijekile.
Hlaziya ijiko lobushushu le-oveni

3.Ukuphinda kufakwe i-solderingumatshiniineendawo ezi-4 zobushushu, i-preheating, ubushushu obungaguqukiyo, ukufudumeza, indawo yokupholisa, indima yendawo yobushushu nganye yahlukile, amanye amacandelo anokuchatshazelwa kukushicilelwa kwe-solder paste engalinganiyo okanye ecaleni komqobo wecandelo eliphezulu le-elektroniki, okukhokelela kubushushu obungalinganiyo, ngaloo ndlela ekufudumezeni ngaphambili ngumahluko wobushushu, okukhokelela kwinqanaba lokufudumeza enye isiphelo solder intlama inyibilike kuqala, kwaye esinye isiphelo ayinyibiliki okanye solder intlama inyibilike ngokucothayo, ngaloo ndlela pad zombini iziphelo tension yahlukile, ekhokelela Ukuma lesikhumbuzo okanye warp.

Ezi ngongoma zingentla zezinye zezizathu eziphambili ze-chip processing capacitor emi isikhumbuzo solder yobuxoki, kunjalo, kukho ezinye izizathu ezintsonkothileyo neziguquguqukayo, kufuneka sinikele ingqalelo ngakumbi kwaye sirekhode xa imveliso yemihla ngemihla.
NeoDen IN12Creflow oven iimpawu
I-1.Inkqubo yokucoca i-welding ye-welding, i-filtration esebenzayo yeegesi ezinobungozi, imbonakalo entle kunye nokukhuselwa kwendalo, ngakumbi ngokuhambelana nokusetyenziswa kwendawo ephezulu.

I-2.Inkqubo yokulawula ineempawu zokudibanisa okuphezulu, ukuphendula ngexesha elifanelekileyo, izinga lokungaphumeleli eliphantsi, ukugcinwa lula, njl.
I-3.Uyilo olulodwa lwemodyuli yokufudumala, kunye nokulawulwa kweqondo lokushisa elichanekileyo, ukusabalalisa ukushisa okufanayo kwindawo yembuyekezo ye-thermal, ukusebenza okuphezulu kwembuyekezo ye-thermal, ukusetyenziswa kwamandla aphantsi kunye nezinye iimpawu.
I-4.I-convection yomoya oshushu, ukusebenza kakuhle kwe-welding.
I-5.I-plate yokufudumeza ekhethekileyo yoyilo iqinisekisa ngokufanelekileyo ukupholisa okufanayo emva kokuba isixhobo siyeke ukufudumeza, ukukhusela ngokufanelekileyo iindawo ukuba zingonakaliswe ngokuhla ngokukhawuleza kweqondo lokushisa kunye nokuguqulwa kwesiphumo.
.6.Ibhokisi lokushisa langaphakathi lenziwe ngensimbi engenasici, ehambelana nokusingqongileyo kunye nevumba, kwaye icala langaphakathi lixhotyiswe ngekotoni yokushisa ukushisa ukukhusela ngokufanelekileyo ukulahleka kobushushu.
I-7.Idizayini efihliweyo yesikrini ilungele ukuthuthwa, kulula ukuyisebenzisa, intle kwaye inesisa.
I-8.inkqubo yokulawula isebenzisa iitshiphusi ezithunyelwa ngaphandle, ukuchaneka kokulawula ubushushu be-± 0.5%
I-9.Yonke imimandla yokushisa kunye nesantya somoya obandayo somoya, ukujamelana ngokulula neemfuno ze-welding.
I-10.Umda ozenzekelayo emva kokuvulwa kwekhava ephezulu, qinisekisa ngokufanelekileyo ukhuseleko lwemveliso.