Ukuhamba komsebenzi kumatshini wokuSolisa wamaza

1. Tshiza i-flux engacocekanga kwibhodi yesekethe

Ifakwe kumacandelo agqityiweyo ebhodi yesekethe, iya kufakwa kwi-jig, ukusuka kumatshini ekungeneni kwesixhobo sokudibanisa kwi-angle ethile yokuthambekela kunye nesantya sokuhambisa kwi.umatshini wokuthambisa wamaza, kwaye emva koko ngokusebenza okuqhubekayo kwekhonkco lokubamba uzipho, indlela yokuva isivamvo, umlomo emva naphambili kunye nendawo yokuqala yejig uniform yokutshiza, ukuze umphezulu oveziweyo webhodi yesekethe, iphedi phezu komngxuma kunye nezikhonkwane zecandelo. umphezulu oqatywe ngokulinganayo kunye nomaleko omncinci we-flux.

2. Ukufudumeza kwangaphambili ibhodi yePCB

Kwindawo yokufudumeza, iinxalenye zebhodi ye-PCB ye-soldering zifudunyezwa kwiqondo lokushisa lokumanzisa, kwangaxeshanye, ngenxa yokwanda kobushushu becandelo, ukuphepha ukuntywiliselwa kwi-solder etyhidiweyo xa iphantsi komothuko omkhulu we-thermal.Inqanaba lokufudumeza, ubushushu bomphezulu we-PCB kufuneka bube phakathi kwe-75 ~ 110 ℃ ifanelekile.

1) Indima yokufudumeza.

① i-solvent kwi-flux iyakhutshwa, enciphisa ukuveliswa kwegesi xa i-soldering.

② i-flux kwi-rosin kunye ne-agent esebenzayo yaqala ukubola kwaye isebenze, inokususa iipads zebhodi eziprintiweyo, iingcebiso zecandelo kunye nezikhonkwane kumphezulu wefilimu ye-oxide kunye nezinye izinto ezingcolisayo, ngelixa idlala indima ekukhuseleni umphezulu wesinyithi ukukhusela ukwenzeka okuphezulu. -ubushushu bokubuyisela kwakhona i-oxidation.

③ ukuze ibhodi PCB kunye namacandelo preheated ngokupheleleyo, ukuphepha ukuwelda xa ukunyuka kabukhali lobushushu eveliswe thermal uxinezeleko umonakalo PCB ibhodi kunye namacandelo.

2) umatshini we-wave soldering kwiindlela eziqhelekileyo zokufudumeza

① Ukufudumeza umoya

② Ukufudumeza isifudumezi se-infrared

③ Ukufudumeza ngendibaniselwano yomoya oshushu kunye nemitha

3. ukwenza imbuyekezo lobushushu for soldering wave.

Ngena kwinqanaba imbuyekezo lobushushu, emva imbuyekezo ibhodi PCB kwi soldering amaza ukunciphisa ukothuka thermal.

4. kwibhodi yesekethe phezu kwamaza okuqala

I-wave yokuqala yi-spout encinci yesantya sokuhamba "kwesiphithiphithi", ukunyanga kunokungena kakuhle kwesithunzi seendawo ze-welding.Kwangaxeshanye, isiphithiphithi samandla ejethi esiya phezulu senza irhasi eshukumayo ikhutshelwe ngaphandle kakuhle, inciphisa kakhulu ukuvuza kwe-solder kunye neziphene zokuzalisa ngokuthe nkqo.

5. Igagasi lesibini lebhodi yesekethe

I-wave yesibini yi-solder "egudileyo" ehamba ngokucothayo, inokususa ngokufanelekileyo i-solder engaphezulu kwi-terminal, ukuze yonke indawo ye-solder imanzise kakuhle, kwaye inokuba liza lokuqala elibangelwa kukutsala incam kunye nebhulorho ukulungisa ngokupheleleyo.

6. ibhodi yesekethe kwisigaba sokupholisa

Inkqubo yokupholisa yenza ukuba ubushushu bePCB buyeke ngokukhawuleza bunokuphucula ngokubonakalayo imveliso ye-lead-free solder eutectic xa ukuveliswa kwamaqamza omoya kunye neengxaki zokuqhawula iitreyi ze-solder.

I-Zhejiang NeoDen Technology Co., Ltd. ibisenza kwaye ithumela ngaphandle ezahlukeneyo ezincinci khetha kwaye ubeke oomatshiniukusukela ngo-2010. Ukuthatha ithuba le-R&D yethu enamava, imveliso eqeqeshwe kakuhle, iNeoDen iphumelela udumo olukhulu kubathengi behlabathi ngokubanzi.

Iimveliso zeNeoDen: Smart series PNP machine, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, reflow oven IN6, IN12, Solder paste printer FP2636, PM3040.

Iziko le-R&D: Amasebe ama-3 e-R&D anama-25+ iinjineli ezichubekileyo ze-R&D

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