14 Iimpazamo zoYilo lwePCB eziqhelekileyo kunye nezizathu

1. PCB akukho edge inkqubo, imingxuma inkqubo, ayikwazi ukuhlangabezana neemfuno SMT isixhobo clamping, nto leyo ethetha ukuba ayikwazi ukuhlangabezana neemfuno imveliso yobuninzi.

2. I-PCB imilo yasemzini okanye ubungakanani obukhulu kakhulu, buncinci kakhulu, obufanayo abanakuhlangabezana neemfuno zezixhobo zokubamba.

3. PCB, FQFP pads ngeenxa akukho uphawu lokubeka optical (uMarko) okanye Mark point ayikho umgangatho, ezifana Mark point ngeenxa solder ukumelana ifilimu, okanye enkulu kakhulu, encinane kakhulu, okubangela ukuba uphawu Mark umahluko encinane kakhulu, umatshini. rhoqo i-alam ayikwazi ukusebenza kakuhle.

4. Ubungakanani besakhiwo se-pad abuchanekanga, njengokuba isithuba se-pad samacandelo e-chip sisikhulu kakhulu, sincinci kakhulu, i-pad ayilingani, ibangele iziphene ezininzi emva kokudityaniswa kwezinto ze-chip, ezifana ne-skewed, isikhumbuzo esimileyo. .

5. Iipads ezinomngxuma ongaphezulu ziya kubangela ukuba i-solder inyibilike ngomngxuma ukuya ezantsi, ibangele i-solder encinci kakhulu.

6. Amacandelo e-chip ubukhulu bephedi abulungelelanisi, ngakumbi ngomgca womhlaba, ngaphezulu komgca wenxalenye yokusetyenziswa njengephedi, ukuzereflow oveni-soldering chip components kuzo zombini iziphelo zobushushu obungalinganiyo iphedi, intlama ye-solder iye yanyibilika kwaye ibangelwa ziziphene zesikhumbuzo.

7. I-IC pad design ayilunganga, i-FQFP kwi-pad ibanzi kakhulu, ibangela ibhulorho emva kwe-welding nokuba, okanye i-pad emva komphetho imfutshane kakhulu ngenxa yokungonelanga kwamandla emva kwe-welding.

8. Iipadi ze-IC phakathi kweengcingo ezidibanisayo ezibekwe phakathi, kungekhona ukulungelelaniswa nokuhlolwa kwe-SMA post-soldering.

9. Umatshini we-wave solderingI-IC ayikho iipads ezincedisayo zoyilo, ezikhokelela kwi-post-soldering bridging.

10. PCB ubukhulu okanye PCB kunikezelo IC akukho ngqiqweni, deformation PCB emva welding.

11. Uyilo lwamanqaku ovavanyo alufani, ukuze i-ICT ingasebenzi.

12. Umsantsa phakathi kwe-SMDs awuchanekanga, kwaye kuvela ubunzima ekulungiseni kamva.

13. I-solder ixhathisa umaleko kunye nemephu yeempawu azifani, kwaye i-solder ixhathisa umaleko kunye nemephu yeempawu eziwela kwiipads ezibangela ukubethelwa kobuxoki okanye ukuqhawulwa kombane.

14. uyilo olungekho ngqiqweni lwebhodi yokudibanisa, efana nokusebenza kakubi kwe-V-slots, okukhokelela kwi-PCB deformation emva kokuhamba kwakhona.

Ezi mpazamo zingentla zinokuthi zenzeke kwenye okanye ngaphezulu kweemveliso eziyilwe kakubi, ezikhokelela kumanqanaba ahlukeneyo empembelelo kumgangatho we-soldering.Abaqulunqi abazi ngokwaneleyo malunga nenkqubo ye-SMT, ngokukodwa amacandelo kwi-reflow soldering inenkqubo "eguquguqukayo" ayiqondi ukuba esinye sezizathu zoyilo olubi.Ukongeza, uyilo kwangethuba aluzange luyihoye inkqubo yabasebenzi ukuba bathathe inxaxheba ekunqongophelweni kwemigaqo yoyilo lweshishini lokwenziwa kwezinto, ikwangunobangela woyilo olubi.

K1830 SMT umgca wemveliso


Ixesha lokuposa: Jan-20-2022

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