11. Amacandelo anoxinzelelo lwexinzelelo akufanele abekwe kwiikona, emaphethelweni, okanye kufuphi neziqhagamshelo, imingxuma ekhulayo, i-grooves, i-cutouts, i-gashes kunye neekona zeebhodi zeesekethe eziprintiweyo.Ezi ndawo ziindawo zoxinzelelo oluphezulu lweebhodi zeesekethe eziprintiweyo, ezinokubangela ukuba kube lula ukuqhekeka okanye ukuqhekeka kumalungu e-solder kunye namacandelo.
12. Uyilo lwamacandelo luya kuhlangabezana nenkqubo kunye neemfuno zezithuba ze-reflow soldering kunye ne-wave soldering.Yehlisa isiphumo sesithunzi ngexesha le-soldering wave.
13. Imingxuma yokubeka ibhodi yesekethe eprintiweyo kunye nenkxaso esisigxina kufuneka ibekelwe bucala ukuze ithathe indawo.
14. Kuyilo lwebhodi yesekethe eprintiweyo indawo enkulu ngaphezu kwe-500cm2, ukwenzela ukuthintela ibhodi yesekethe eprintiweyo ekugobeni xa iwela isithando somlilo, umsantsa we-5 ~ 10mm ububanzi kufuneka ushiywe phakathi kwebhodi yesekethe eprintiweyo, kwaye amacandelo (anokuhamba) akufanele abekwe, ukuze ukuthintela ibhodi yesekethe eprintiweyo ekugobeni xa iwela isithando somlilo.
15. Isalathiso soyilo lwecandelo lenkqubo yokuphinda kufakwe i-solder.
(1) Isalathiso soyilo lwamacandelo kufuneka siqwalasele isalathiso sebhodi yesekethe eprintiweyo kwisithando somlilo.
(2) ukuze wenze isiphelo ezimbini amacandelo chip kumacala omabini ekupheleni weld kunye amacandelo SMD kumacala omabini ungqamaniso pin ishushu, ukunciphisa amacandelo kumacala omabini ekupheleni welding ayivelisi ukumiswa, shift. , ubushushu obuhambelanayo obuvela kwiziphene ze-welding ezifana ne-solder welding end, zifuna isiphelo ezibini zamacandelo e-chip kwibhodi yesekethe eprintiweyo i-axis ende kufuneka ibe perpendicular ukuya kwicala lebhanti lokuhambisa le-oven reflow.
(3) I-axis ende yamacandelo e-SMD kufuneka ihambelane nolwalathiso lokudluliselwa kwesithando somlilo.I-axis ende yamacandelo e-CHIP kunye ne-axis ende yamacandelo e-SMD kuzo zombini iziphelo kufuneka ibe perpendicular omnye komnye.
(4) Uyilo oluhle loyilo lwamacandelo akufunekanga luqwalasele ukufana kwamandla obushushu, kodwa kwakhona luqwalasele isalathiso kunye nokulandelelana kwamacandelo.
(5) Kwibhodi yesekethe eprintiweyo ubungakanani obukhulu, ukuze kugcinwe ubushushu kumacala omabini ebhodi yesekethe eprintiweyo ngokungqinelana kangangoko kunokwenzeka, icala elide lebhodi yesekethe eprintiweyo kufuneka lihambelane nolwalathiso lwebhanti lokuhambisa lokujikeleza kwakhona. eziko.Ke ngoko, xa ubukhulu bebhodi yesekethe eprintiweyo inkulu kune-200mm, iimfuno zezi zilandelayo:
(A) i-axis ende yecandelo le-CHIP kwiziphelo zombini i-perpendicular kwicala elide lebhodi yesekethe eprintiweyo.
(B) I-axis ende yecandelo le-SMD ihambelana necala elide lebhodi yesekethe eprintiweyo.
(C)Kwibhodi yesekethe eprintiweyo edityaniswe macala omabini, amacandelo kumacala omabini ane-orientation efanayo.
(D)Lungisa isikhokelo samacandelo kwibhodi yesekethe eprintiweyo.Amacandelo afanayo kufuneka ahlelwe ngendlela efanayo ngokusemandleni, kwaye isalathiso sempawu kufuneka sibe yinto efanayo, ukwenzela ukuba kube lula ukufakwa, i-welding kunye nokufumanisa amacandelo.Ukuba i-electrolytic capacitor positive pole, i-diode positive pole, i-transistor enye yepini ekupheleni, ipini yokuqala yendlela yolungiselelo lwesekethe edibeneyo iyahambelana kangangoko kunokwenzeka.
16. Ukuze uthintele isiphaluka esifutshane phakathi kweengqimba ezibangelwa ngokuchukumisa ucingo oluprintiweyo ngexesha lokucubungula i-PCB, ipateni yokuqhubela phambili yomaleko wangaphakathi kunye nomgangatho wangaphandle kufuneka ube ngaphezu kwe-1.25mm ukusuka kwi-PCB edge.Xa ucingo oluphantsi lubekwe kumda we-PCB yangaphandle, ucingo lomhlaba lunokuhlala kwindawo esekupheleni.Kwizikhundla eziphezulu zePCB eziye zahlala ngenxa yeemfuno zesakhiwo, amacandelo kunye nabaqhubi abaprintiweyo akufuneki babekwe kwindawo engaphantsi kwe-solder pad ye-SMD/SMC ngaphandle kwemingxunya, ukuze kuthintelwe ukuphambuka kwe-solder emva kokufudunyezwa kunye nokunyibilikiswa kwamaza. i-soldering emva kokuthengiswa kwakhona.
17. Isithuba sofakelo lwamacandelo: Ubuncinane besithuba sofakelo lofakelo lwamacandelo kufuneka buhlangabezane neemfuno zendibano ye-SMT ukwenzela ukwenziwa, ukuvavanywa, kunye nokugcinwa.
Ixesha lokuposa: Dec-21-2020