Uhlalutyo lweeMbangela zeSoldering eqhubekayo kunye ne-Wave Soldering

1. iqondo lokushisa elingafanelekanga.Iqondo lobushushu eliphantsi kakhulu liya kubangela ukusebenza kakubi kokuguquguquka okanye ibhodi ye-PCB kunye nobushushu obungonelanga, okukhokelela kubushushu obunganelanga betoti, ukuze amandla okumanzisa i-solder yolwelo kunye nolwelo lube buthathaka, imigca ekufutshane phakathi kwebhulorho edibeneyo ye-solder.

2. Ubushushu be-Flux preheat iphezulu kakhulu okanye iphantsi kakhulu, ngokubanzi kwi-100 ~ 110 degrees, i-preheat iphantsi kakhulu, umsebenzi we-flux awuphezulu.Ukushisa okuphezulu kakhulu, kwi-tin steel flux iphelile, kodwa kulula nokuba i-tin.

3. Akukho flux okanye i-flux ayanelanga okanye ayilingani, ukunyanzeliswa komphezulu we-tin etyhidiweyo ayikhutshwa, okukhokelela ekubeni kube lula ukubethelwa.

4. Khangela iqondo lokushisa lesithando somlilo, lilawule malunga nama-degrees angama-265, kungcono ukusebenzisa i-thermometer ukulinganisa ubushushu be-wave xa i-wave idlalwa phezulu, kuba inzwa yokushisa yesixhobo ingaba ngezantsi. eziko okanye kwezinye iindawo.Ukushisa okunganeleyo kokushisa kuya kukhokelela kumacandelo akakwazi ukufikelela kwiqondo lobushushu, inkqubo ye-welding ngenxa yecandelo lokufunxa ubushushu, okukhokelela ekutsaleni kakubi i-tin, kunye nokwakheka kwetoti;kusenokubakho ubushushu obuphantsi beziko letoti, okanye isantya sewelding sikhawuleza kakhulu.

5. Indlela yokusebenza engafanelekanga xa isandla sidipha inkonkxa.

6. ukuhlolwa rhoqo ukwenza uhlalutyo lokubunjwa kwe-tin, kunokubakho ubhedu okanye omnye umxholo wesinyithi udlula umgangatho, okubangelwa ukuhamba kwe-tin kuyancipha, kulula ukubangela nokuba i-tin.

7. i-solder engcolileyo, i-solder ekungcoleni okudityanisiweyo idlula umgangatho ovumelekileyo, iimpawu ze-solder ziya kutshintsha, ukumanzisa okanye ukukhupha amanzi kuya kuba kubi kakhulu, ukuba umxholo we-antimony ongaphezulu kwe-1.0%, i-arsenic ngaphezu kwe-0.2%, ihlukaniswe ngaphezu kwe-0.2% I-0.15%, i-fluidity ye-solder iya kuncitshiswa ngama-25%, ngelixa umxholo we-arsenic ongaphantsi kwe-0.005% uya ku-de-wetting.

8. khangela i-angle ye-wave soldering track angle, i-7 degrees yeyona nto ingcono, i-flat kakhulu kulula ukuxhoma i-tin.

9. PCB ibhodi deformation, le meko iya kukhokelela PCB ekhohlo embindini ekunene ezintathu uxinzelelo amaza ubunzulu ukungaguquguquki, kwaye kubangelwa ukutya inkonkxa nzulu indawo tin flow ayigudi, kulula ukuvelisa ibhulorho.

10. IC kunye nomqolo woyilo olubi, zidityaniswe, amacala amane e-IC ashinyeneyo unyawo isithuba <0.4mm, akukho angle yokuthambeka ebhodini.

11.pcb eshushu embindini deformation deformation okubangelwa nkqu netoti.

12. PCB ibhodi welding engile, ngokwethiyori enkulu i-engile, amalungu solder kumaza ukusuka amaza phambi nasemva amalungu solder ukusuka amaza xa amathuba umphezulu eqhelekileyo mancinane, amathuba ibhulorho kwakhona amancinci.Nangona kunjalo, i-angle ye-solder inqunywe yimpawu zokumanzisa kwe-solder ngokwayo.Ngokuqhelekileyo, i-engile ye-lead soldering ilungelelaniswa phakathi kwe-4 ° kunye ne-9 ° ngokuxhomekeke kuyilo lwe-PCB, ngelixa i-solder-free soldering ilungelelaniswa phakathi kwe-4 ° kunye ne-6 ° ngokuxhomekeke kuyilo lwe-PCB yomthengi.Kufuneka kuqatshelwe ukuba kwi-engile enkulu inkqubo welding, isiphelo sangaphambili se-PCB dip tin iya kubonakala isitya inkonkxa ekuswelekeni kwetoti kwimeko, ebangelwa kubushushu bebhodi ye-PCB ukuya phakathi i-concave, ukuba imeko enjalo kufuneka ifaneleke ukunciphisa i-angle ye-welding.

13. phakathi kweebhodi zebhodi yesekethe ayenzelwanga ukuxhathisa i-solder dam, emva kokushicilela kwi-solder paste edibeneyo;okanye ibhodi yesekethe ngokwayo yenzelwe ukuxhathisa solder dam / ibhulorho, kodwa kwimveliso egqityiweyo ibe yinxalenye okanye zonke off, ke kwakhona kulula nokuba toti.

ND2+N8+T12


Ixesha lokuposa: Nov-02-2022

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