Ukugqwethwa kwe-PCB yingxaki eqhelekileyo kwimveliso yobuninzi be-PCBA, eya kuba nempembelelo enkulu kwindibano kunye novavanyo, okubangela ukungazinzi komsebenzi wesekethe ye-elektroniki, isiphaluka esifutshane / ukusilela kwesekethe evulekileyo.
Iimbangela zePCB deformation zezi zilandelayo:
1. Ubushushu bebhodi yePCBA yokudlula eziko
Iibhodi zeesekethe ezahlukeneyo zinokunyamezela ubushushu obukhulu.Xa ireflow ovenizinga lokushisa liphezulu kakhulu, liphezulu kunexabiso eliphezulu lebhodi yesekethe, liya kubangela ukuba ibhodi ithambe kwaye ibangele ukuguqulwa.
2. Unobangela PCB ibhodi
Ukuthandwa kobuchwephesha obungenalo ilothe, iqondo lobushushu leziko liphezulu kunelothe, kwaye iimfuno zeteknoloji yepleyiti ziphezulu kwaye ziphezulu.Ixabiso eliphantsi le-TG, ngokulula ngakumbi ibhodi yesekethe iya konakala ngexesha lesithando somlilo.Ixabiso eliphezulu le-TG, ibhodi iya kuba yindleko ngakumbi.
3. Ubungakanani bebhodi yePCBA kunye nenani leebhodi
Xa ibhodi yesekethe iphelileumatshini wokuwelda kwakhona, ngokuqhelekileyo ifakwe kwikhonkco yokuhanjiswa, kwaye amatyathanga emacaleni omabini asebenza njengeendawo zokuxhasa.Ubungakanani bebhodi yesekethe bukhulu kakhulu okanye inani leebhodi likhulu kakhulu, okukhokelela ekudakaleni kwebhodi yesekethe ukuya kwindawo ephakathi, okubangela ukuguqulwa.
4. Ukutyeba kwebhodi yePCBA
Ngokuphuhliswa kweemveliso ze-elektroniki kwindlela encinci kunye nencinci, ubukhulu bebhodi yesekethe buyancipha.Ibhodi yesekethe encinci, kulula ukubangela ukuguqulwa kwebhodi phantsi kwefuthe lobushushu obuphezulu xa i-welding i-reflow.
5. Ubunzulu be-v-cut
I-V-cut iya kutshabalalisa i-sub-structure yebhodi.I-V-cut iya kusika i-grooves kwiphepha elikhulu lokuqala.Ukuba umgca we-V-cut unzulu kakhulu, ukuguqulwa kwebhodi ye-PCBA kuya kubangelwa.
Amanqaku oqhagamshelwano lwemaleko kwibhodi PCBA
Ibhodi yesekethe yanamhlanje ibhodi ye-multi-layer, kukho iindawo ezininzi zokudibanisa ukomba, la manqaku oqhagamshelwano ahlulwe ngomngxuma, umngxuma oyimfama, umngxuma ongcwatyiweyo, ezi ndawo zokudibanisa ziya kunciphisa umphumo wokwandiswa kwe-thermal kunye nokucutha kwebhodi yesekethe. , okubangela ukuguqulwa kwebhodi.
Izisombululo:
1. Ukuba ixabiso kunye nendawo iyakuvumela, khetha i-PCB ene-Tg ephezulu okanye yandise ubukhulu be-PCB ukufumana owona mlinganiselo ubalaseleyo.
2. Ukuyila i-PCB ngokufanelekileyo, indawo ye-foil yensimbi ephindwe kabini kufuneka ilungelelaniswe, kwaye umaleko wobhedu kufuneka ugutyungelwe apho kungekho sekethe, kwaye ubonakale ngendlela yegridi ukunyusa ukuqina kwe-PCB.
3. I-PCB i-pre-baked phambi kwe-SMT ngo-125℃/4h.
4. Lungisa i-fixture okanye umgama wokubamba ukuqinisekisa indawo yokwandiswa kokufudumeza kwe-PCB.
5. Ubushushu benkqubo yokuwelda buphantsi kangangoko;Ukuphazamiseka okuncinci kuye kwabonakala, kunokufakwa kwindawo yokubeka indawo, ukusethwa kwakhona kweqondo lokushisa, ukukhulula uxinzelelo, ngokubanzi iziphumo ezanelisayo ziya kufumaneka.
Ixesha lokuposa: Oct-19-2021