Eli phepha libala imiqathango yobuchwephesha eqhelekileyo kunye neengcaciso zokusetyenzwa komgca wendibanoUmatshini we-SMT.
21. BGA
I-BGA imfutshane kwi-"Ball Grid Array", ebhekisa kwisixhobo sesekethe esihlanganisiweyo apho isixhobo sikhokela sicwangciswe ngokwemilo yegridi engqukuva kumphezulu ongezantsi wepakethe.
22. QA
I-QA imfutshane kwi-"Quality assurance", ibhekisa kuQinisekiso loMgangatho.Kwikhetha kwaye ubeke umatshiniukusetyenzwa kudla ngokumelwa ngokuhlolwa komgangatho, ukuqinisekisa umgangatho.
23. Ukuwelda okungenanto
Akukho tin phakathi kwepini yecandelo kunye nephedi ye-solder okanye akukho soldering ngenxa yezinye izizathu.
24.Hlaziya i-OvenI-welding yobuxoki
Isixa se-tin phakathi kwepini yecandelo kunye ne-solder pad incinci kakhulu, engaphantsi komgangatho we-welding.
25. ukuwelda okubandayo
Emva kokuba i-solder paste iphiliswe, kukho i-particle attachment engacacanga kwi-solder pad, engekho kumgangatho we-welding.
26. Amalungu angalunganga
Indawo engafanelekanga yamacandelo ngenxa ye-BOM, impazamo ye-ECN, okanye ezinye izizathu.
27. Amalungu angekhoyo
Ukuba akukho candelo elithengiswayo apho icandelo kufuneka lithengiswe, libizwa ngokuba lilahlekile.
28. Ibhola yenkcenkce ye-tin slag
Emva kokudityaniswa kwebhodi yePCB, kukho ibhola yenkcenkce eyongezelelweyo yenkcenkce.
29. Uvavanyo lwe-ICT
Khangela isekethe evulekileyo, isiphaluka esifutshane kunye ne-welding yawo onke amacandelo e-PCBA ngokuvavanya indawo yokuhlola yoqhagamshelwano.Ineempawu zokusebenza okulula, indawo ephoso ngokukhawuleza kunye nechanekileyo
30. Uvavanyo lweFCT
Uvavanyo lwe-FCT ludla ngokubizwa ngokuba luvavanyo olusebenzayo.Ngokusebenzisa ukulinganisa indawo yokusebenza, i-PCBA ikwiimeko ezahlukeneyo zoyilo emsebenzini, ukuze ufumane iiparamitha zelizwe ngalinye ukuqinisekisa umsebenzi we-PCBA.
31. Uvavanyo lokuguga
Uvavanyo lokutshisa kukulinganisa iziphumo zezinto ezahlukeneyo kwi-PCBA ezinokuthi zenzeke kwiimeko zokwenene zokusetyenziswa kwemveliso.
32. Uvavanyo lokungcangcazela
Uvavanyo lokungcangcazela kukuvavanya isakhono sokuchasa ukungcangcazela kwamacandelo afanayo, iinxalenye ezisecaleni kunye neemveliso ezipheleleyo zoomatshini kwindawo yokusetyenziswa, uthutho kunye nenkqubo yofakelo.Ukukwazi ukumisela ukuba imveliso inokumelana neentlobo ezahlukeneyo zokungcangcazela kokusingqongileyo.
33. Igqityiwe indibano
Emva kokugqitywa kovavanyo lwe-PCBA kunye neqokobhe kunye namanye amacandelo ahlanganiswe ukwenza imveliso egqityiweyo.
34. I-IQC
I-IQC sisishunqulelo esithi "Ukulawulwa koBulunga obungenayo", kubhekiselele kuhlolo loMgangatho ongenayo, yindawo yokugcina impahla yokuthenga uLawulo loMgangatho.
35. X - ukufunyanwa kweRay
Ukungena kwe-X-ray kusetyenziselwa ukufumanisa ubume bangaphakathi bezinto ze-elektroniki, i-BGA kunye nezinye iimveliso.Ingasetyenziselwa ukukhangela umgangatho we-welding we-solder joints.
36. umnatha wentsimbi
Umnatha wentsimbi sisingundo esikhethekileyo se-SMT.Umsebenzi wayo ophambili kukuncedisa ekubekeni i-solder paste.Injongo kukudlulisa elona nani lichanekileyo lokuncamathisela kwi-solder kwindawo echanekileyo kwibhodi ye-PCB.
37. umzobo
Iijigs ziyimveliso ekufuneka isetyenziswe kwinkqubo yokuvelisa ibhetshi.Ngoncedo lokuveliswa kweejigs, iingxaki zokuvelisa zingancitshiswa kakhulu.Iijigs zihlulwe ngokubanzi zibe ziindidi ezintathu: iijigi zendibano zenkqubo, iijigi zovavanyo lweprojekthi kunye neejigi zovavanyo lwebhodi yesekethe.
38. IPQC
Ulawulo lomgangatho kwinkqubo yokwenziwa kwe-PCBA.
39. OQA
Ukuhlolwa komgangatho weemveliso ezigqityiweyo xa ziphuma kumzi-mveliso.
40. Itshekhi yokwenziwa kwe-DFM
Lungiselela uyilo lwemveliso kunye nemigaqo yokuvelisa, inkqubo kunye nokuchaneka kwamacandelo.Ziphephe iingozi zemveliso.
Ixesha lokuposa: Jul-09-2021