Ukuqhekeka kwejoyinti ye-solder kwi-plated through joint ayiqhelekanga;kwi-Figure 1 i-solder joint ikwibhodi enye.Umdibaniso awuphumelelanga ngenxa yokwandiswa kunye nokucutheka kwesikhokelo kwindawo edibeneyo.Kule meko impazamo ilele kuyilo lokuqala njengoko ibhodi ingahlangabezani neemfuno zendawo yokusebenza kwayo.Amalungu ahlangeneyo angaphumeleli ngexesha lokuhlanganisana ngenxa yokuphathwa kakubi kodwa kulo mzekelo umphezulu wokudibanisa ubonisa imigca yoxinzelelo oluye lwaveliswa ngexesha lokuhamba ngokuphindaphindiweyo.
Umzobo 1: Imigca yoxinzelelo apha ibonisa ukuba oku kuqhekeka kwibhodi esecaleni elilodwa kwakubangelwa ukunyakaza okuphindaphindiweyo ngexesha lokucubungula.
Umzobo we-2 ubonisa ukuqhekeka malunga nesiseko se-fillet kwaye uye wahlula kwi-copper pad.Oku kunokwenzeka ukuba kunxulumene nesiseko solderability yebhodi.Ukumanzisa phakathi kwe-solder kunye ne-pad surface akwenzekanga okukhokelela ekuhlulekeni kokudibeneyo.Ukuqhekeka kwamalungu kuya kwenzeka ngesiqhelo ngenxa yokwanda kwe-thermal yejoyinti kwaye oku kuya kuhambelana noyilo lwangaphambili lwemveliso.Akuqhelekanga kakhulu ukuba ukusilela kwenzeke namhlanje ngenxa yamava kunye novavanyo lwangaphambili oluqhutywa ziinkampani ezininzi eziphambili ze-elektroniki.
Umzobo 2: Ukunqongophala kokumanzi phakathi kwe-solder kunye ne-pad surface kubangele ukuqhekeka kwisiseko sefayili.
Ixesha lokuposa: Mar-14-2020