Isiphene semingxuma yokuvuthela kwiPCB

Imingxunya yePin & Vuthela imingxuma kwiBhodi yeSekethe eShicileleyo

Imingxunya ye-Pin okanye imingxuma yokuvuthela yinto enye kwaye ibangelwa yibhodi eprintiweyo yokukhupha ngexesha le-soldering.I-Pin kunye nokuvuthela ukubunjwa kwemingxuma ngexesha le-soldering ye-wave ihlala ihambelana nobukhulu be-plating yobhedu.Ukufuma ebhodini kusinda mhlawumbi ngobhedu obhityileyo plating okanye voids kwi plating.Ukucakwa kumngxuma ophumela ngaphandle kufuneka kubuncinci be-25um ukunqanda ukufuma kwebhodi ukujikela kumphunga wamanzi kunye negesi kudonga lobhedu ngexesha le-wave soldering.

Igama elithi iphini okanye umngxuma wokuvuthela lidla ngokusetyenziswa ukubonisa ubungakanani bomngxuma, isikhonkwane sincinci.Ubungakanani buxhomekeke kuphela kumthamo womphunga wamanzi ophuncukileyo kunye nenqaku le-solder liqina.

Umzobo 1: Vuthela umngxuma

Ekuphela kwendlela yokuphelisa le ngxaki kukuphucula umgangatho webhodi ngobuncinci be-25um yobhedu beplate kumngxuma odlulayo.Ukubhaka kudla ngokusetyenziselwa ukuphelisa iingxaki zegesi ngokumisa ibhodi.Ukubhaka ibhodi kuthatha amanzi ngaphandle kwebhodi, kodwa ayisombululi ingcambu yengxaki.

Umzobo 2: I-Pin Hole

UVavanyo olungonakaliyo lweMingxunya yePCB

Uvavanyo lusetyenziselwa ukuvavanya iibhodi zeesekethe eziprintiweyo ezifakwe kwimingxuma yokukhupha.Ibonisa ukubakho kokutyalwa okucekethekileyo okanye i-voids ekhoyo ngokuqhagamshelwa komngxuma.Ingasetyenziselwa ukufunyanwa kwempahla, ngexesha lemveliso okanye kwiindibano zokugqibela zokugqiba ukufumanisa imbangela ye-voids kwiifayili ze-solder.Ngaphandle kokuba ukhathalelo luthathiwe ngexesha lokuvavanya iibhodi zingasetyenziselwa imveliso emva kovavanyo ngaphandle kokulimaza ukubonakala okubonakalayo okanye ukuthembeka kwemveliso yokugqibela.

Izixhobo zovavanyo

• Isampula yeebhodi zeesekethe eziprintiweyo zokuvavanya
• Ioyile yaseCanada yeBolson okanye enye indlela efanelekileyo ecacileyo ecacileyo yokuhlolwa okubonakalayo kwaye inokususwa ngokulula emva kovavanyo
• Isirinji yeHypodermic yokusetyenziswa kweoyile kumngxuma ngamnye
• Iphepha lokuvala lokususa ioli egqithisileyo
• Imicroscope enezibane eziphezulu nangaphantsi.Kungenjalo, uncedo olufanelekileyo lokukhulisa phakathi kwe-5 ukuya kwi-25x yokukhulisa kunye nebhokisi yokukhanya.
• Isinyithi soldering kunye nolawulo lobushushu

Indlela yoVavanyo

1. Isampula yebhodi okanye inxalenye yebhodi ikhethelwa uviwo.Ukusebenzisa isirinji ye-hypodermic, gcwalisa imingxuma nganye yokuhlolwa ngeoli ecacileyo.Ukuhlolwa okusebenzayo, kuyimfuneko ukuba ioli yenze i-meniscus ye-concave ebusweni bomngxuma.Ifom ye-concave ivumela imbono ye-optical ye-plated epheleleyo ngomngxuma.Indlela elula yokwenza i-meniscus ye-concave ebusweni kunye nokususa ioli engaphezulu kukusebenzisa iphepha lokuqhawula.Kwimeko nayiphi na i-entrapment yomoya ekhoyo emngxunyeni, ioli eyongezelelweyo isetyenziswe kuze kube yilapho imbonakalo ecacileyo yendawo yangaphakathi epheleleyo ifunyenwe.
2. Ibhodi yesampula ifakwe phezu komthombo wokukhanya;oku kuvumela ukukhanya kweplating ngomngxuma.Ibhokisi yokukhanya elula okanye inqanaba elisezantsi elikhanyayo kwi-microscope linokubonelela ngokukhanya okufanelekileyo.Kuya kufuneka i-optical viewing aid efanelekileyo ukujonga umngxuma ngexesha lovavanyo.Kuvavanyo ngokubanzi, ukukhulisa i-5X kuya kuvumela ukujonga ukubunjwa kweqamza;Uvavanyo oluthe kratya lwe- through hole, ulwandiso lwe-25X kufuneka lusetyenziswe.
3. Emva koko, phinda ujikeleze i-solder kwi-plated ngokusebenzisa imingxuma.Oku kwakhona kufudumeza indawo yebhodi ejikelezileyo.Eyona ndlela ilula yokwenza oku kukusebenzisa isinyithi esine-fine-tipped soldering kwi-pad area ebhodini okanye kumzila odibanisa kwindawo ye-pad.Iqondo lobushushu lencam linokwahluka, kodwa i-500°F iqhele ukwanelisa.Umngxuma kufuneka uhlolwe ngexesha elifanayo ngexesha lokusetyenziswa kwentsimbi ye-soldering.
4. Imizuzwana emva kokugcwala ngokupheleleyo kwenkcenkce yenkcenkce ekhokelela kumngxunya, amaqamza aya kubonwa ephuma kuyo nayiphi na indawo ebhityileyo okanye enemingxuma kwi-plating.I-Outgassing ibonwa njengomlambo oqhubekayo wamaqamza, obonisa imingxuma ye-pin, iintanda, i-voids okanye i-plating encinci.Ngokubanzi ukuba ukukhutshwa kubonwa, kuya kuqhubeka ixesha elide;kwiimeko ezininzi iya kuqhubeka de umthombo wobushushu ususwe.Oku kunokuqhubeka kangangemizuzu eyi-1-2;kwezi meko ubushushu bunokubangela ukuguquka kwemibala yezinto zebhodi.Ngokuqhelekileyo, uvavanyo lunokwenziwa kwimizuzwana engama-30 yokusetyenziswa kobushushu kwisekethe.
5. Emva kokuvavanya, ibhodi inokucocwa kwi-solvent efanelekileyo ukususa ioli esetyenziswe ngexesha lovavanyo.Uvavanyo luvumela uvavanyo olukhawulezayo nolusebenzayo lomphezulu wobhedu okanye i-tin / lead plating.Uvavanyo lunokusetyenziswa kwimingxuma engenazinkcenkce/imiphezulu yelothe;kwiimeko zezinye iingubo eziphilayo, nakuphi na ukugquma ngenxa yeengubo kuya kuphela kwimizuzwana embalwa.Uvavanyo lukwanika ithuba lokurekhoda iziphumo zombini kwividiyo okanye kwifilimu kwingxoxo yexesha elizayo.

Inqaku kunye nemifanekiso evela kwi-intanethi, ukuba kukho naluphi na ulwaphulo pls kuqala uqhagamshelane nathi ukuze ucime.
I-NeoDen ibonelela ngezisombululo zomgca wendibano ye-SMT epheleleyo, kubandakanywa i-oven ye-SMT reflow, umatshini wokuthengisa amaza, umatshini wokukhetha kunye nendawo, umshicileli we-solder paste, isilayishi se-PCB, i-PCB yokothula, i-chip mounter, umatshini we-SMT AOI, umatshini we-SMT SPI, umatshini we-SMT X-Ray, Isixhobo somgca we-SMT, imveliso ye-PCB Izixhobo ze-SMT ezisecaleni, njl.njl naluphi na uhlobo oomatshini be-SMT onokubafuna, nceda uqhagamshelane nathi ngolwazi oluthe kratya:

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