1. Ukudityaniswa komphezulu okhethwayo kunye namacandelo e-crimping
Amalungu endibano yomgangatho ongaphezulu kunye nezixhobo zokukhuhla, kunye netekhnoloji elungileyo.
Ngophuhliso lwetekhnoloji yokupakisha yecandelo, uninzi lwamacandelo anokuthengwa kwiindidi zepakethe ye-reflow welding, kubandakanywa neeplagi-in components ezinokuzisebenzisa nge-hole reflow welding.Ukuba idizayini inokufezekisa indibano epheleleyo yomhlaba, iya kuphucula kakhulu ukusebenza kunye nomgangatho wokuhlanganisa.
Amacandelo esitampu ikakhulu ziziqhagamshelo ezininzi.Olu hlobo lokupakisha lukwanalo ukwenziwa kakuhle kunye nokuthembeka koqhagamshelo, olukwayinto ekhethwayo.
2. Ukuthatha umphezulu wendibano ye-PCBA njengento, isikali sokupakisha kunye nesithuba se-pin ziqwalaselwa ngokupheleleyo.
Isikali sokupakisha kunye ne-pin izithuba zezona zinto zibalulekileyo ezichaphazela inkqubo yebhodi yonke.Kwisiseko sokukhetha amacandelo endibano yomphezulu, iqela leepakethe ezineempawu zobuchwepheshe ezifanayo okanye ezilungele ukuncamathelisa ukuprintwa komnatha wentsimbi wobunzima obuthile kufuneka kukhethwe iPCB enobungakanani obuthile kunye noxinaniso lwendibano.Ngokomzekelo, ibhodi yefowuni ephathwayo, iphakheji ekhethiweyo ifanelekile kwi-welding paste printing kunye ne-0.1mm yentsimbi yentsimbi.
3. Nciphisa indlela yenkqubo
Imfutshane indlela yenkqubo, iphezulu ukusebenza kakuhle kwemveliso kunye nomgangatho othembekileyo.Eyona ndlela yoyilo lwenkqubo yile:
Icala elinye lokuwelda kwakhona;
I-welding ephindwe kabini ye-reflow;
Ukuwelda kwecala eliphindwe kabini + ukuwelda kwamaza;
Icala eliphindwe kabini le-welding ye-welding + ekhethiweyo ye-solder wave;
Ukuwelda kwecala eliphindwe kabini + ukuwelda ngesandla.
4. Lungiselela uyilo lwecandelo
Uyilo loyilo lwecandelo lomgaqo lubhekiselele ikakhulu kuyilo lwecandelo kunye noyilo lwezithuba.Uyilo lwamacandelo kufuneka luhlangabezane neemfuno zenkqubo ye-welding.Uyilo lwenzululwazi kunye nolunengqiqo lunokunciphisa ukusetyenziswa kwamalungu amabi e-solder kunye nezixhobo zokusebenza, kunye nokwandisa uyilo lwe-mesh yensimbi.
5. Qwalasela uyilo lwe-solder pad, ukuxhathisa i-solder kunye nefestile yentsimbi ye-mesh
Uyilo lwe-solder pad, ukuxhathisa i-solder kunye nefestile ye-mesh yensimbi inquma ukuhanjiswa kwangempela kwe-solder paste kunye nenkqubo yokuqulunqa i-solder joint.Ukulungelelanisa uyilo lwe-welding pad, ukumelana ne-welding kunye ne-mesh yentsimbi kudlala indima ebaluleke kakhulu ekuphuculeni izinga lokuwelda.
6. Gxininisa kwipakethe entsha
Okubizwa ngokuba yi-packaging entsha, ayibhekiseli ngokupheleleyo kwi-package entsha yemarike, kodwa ibhekisela kwinkampani yabo ayinamava ekusebenziseni ezo phakheji.Ukungeniswa kweepakethe ezintsha, ukuqinisekiswa kwenkqubo yebhetshi encinci kufuneka kwenziwe.Abanye banokusebenzisa, oko akuthethi ukuba ungasebenzisa kwakhona, ukusetyenziswa kwesiseko kufuneka kwenziwe iimvavanyo, ukuqonda iimpawu zenkqubo kunye ne-spectrum yengxaki, i-countermeasures.
7. Gxininisa kwi-BGA, i-chip capacitor kunye ne-crystal oscillator
I-BGA, i-chip capacitors kunye ne-crystal oscillators zizinto eziqhelekileyo ezithintela uxinzelelo, ekufuneka ziphetshwe kangangoko kunokwenzeka kwi-PCB yokugoba i-deformation kwi-welding, indibano, i-workshop turnover, ukuthutha, ukusetyenziswa kunye namanye amakhonkco.
8. Amatyala okufunda ukuphucula imithetho yoyilo
Imithetho yoyilo lokwenziwa kwezinto ithathwe kwindlela yokwenza imveliso.Kubaluleke kakhulu ukunyusa ngokuqhubekayo kunye nokugqibelela imithetho yoyilo ngokuqhubekeka kwendibano embi okanye iimeko zokungaphumeleli ukuphucula uyilo lokwenziwa.
Ixesha lokuposa: Dec-01-2020