Umatshini we-wave solderingyinkqubo yokuthengisela esetyenziswa kwishishini lokuvelisa i-electronics ukuya kumacandelo e-solder kwiibhodi zesekethe.Ngexesha lenkqubo yokuthengiswa kwamaza, inkunkuma iyaveliswa.Ukuze kuncitshiswe ukuveliswa kwenkunkuma, inokulawulwa ngokulungelelanisa iiparamitha ze-solder wave.Ezinye zeendlela ezinokuzanywa kwabelwana ngazo apha ngezantsi:
1. Lungisa ubushushu be-preheat kunye nexesha: ukushisa kwe-preheat kuphezulu kakhulu okanye kude kakhulu kuya kubangela ukunyibilika okugqithisileyo kunye nokubola kwe-solder, ngaloo ndlela ukuvelisa inkunkuma.Ngoko ke, ukushisa kwangaphambili kunye nexesha kufuneka kulungiswe ngokufanelekileyo ukuqinisekisa ukuba i-solder ine-fluidity efanelekileyo kunye ne-solderability.
2. Lungisa ubungakanani be-flux spray: i-flux spray eninzi kakhulu iya kukhokelela ekumanziseni okugqithisileyo kwe-solder, okukhokelela ekuveliseni inkunkuma.Ngoko ke, isixa se-flux spray kufuneka silungiswe ngokufanelekileyo ukuqinisekisa ukuba i-solder inokumanzi okufanelekileyo.
3. Lungisa ubushushu be-solder kunye nexesha: ubushushu obuphezulu kakhulu okanye ixesha elide kunokukhokelela ekunyibilikeni okugqithisileyo kunye nokubola kwe-solder, kubangele inkunkuma.Ngoko ke, ukushisa kwe-solder kunye nexesha kufuneka kulungiswe ngokufanelekileyo ukuqinisekisa ukuba i-solder ine-fluidity efanelekileyo kunye ne-solderability.
4. Lungisa ukuphakama kwamaza: ukuphakama kakhulu kwamaza kunokukhokelela ekunyibilikeni okugqithisileyo kunye nokubola kwesolder xa ifikelela kwincopho yamaza, okukhokelela kwinkunkuma.Ngoko ke, ukuphakama kwamaza kufuneka kulungiswe ngokufanelekileyo ukuqinisekisa ukuba i-solder inesantya esifanelekileyo kunye ne-solderability.
5. Sebenzisa i-solder-resistant: I-solder-resistant-resistant eyenzelwe ngokukodwa ukuthengiswa kwamaza kunokunciphisa ukuveliswa kwenkunkuma.Le solder inokwakheka kweekhemikhali ezikhethekileyo kunye ne-alloy ratio ethintela i-solder ekuboleni kunye ne-oxidising kwi-wave, ngaloo ndlela inciphisa ukuveliswa kwenkunkuma.
Kubalulekile ukuqaphela ukuba ezi ndlela zinokufuna iinzame ezininzi kunye nohlengahlengiso lokufumana ezona parameters zokuthengisela amaza kunye neemeko zenkqubo.Kwakhona kubalulekile ukulandela imigangatho efanelekileyo kunye neenkcukacha zeshishini lokuvelisa i-electronics ukuqinisekisa umgangatho wemveliso kunye nokhuseleko lwemveliso.
Iimpawu zeNeoDen Wave Soldering Machine
Umzekelo: ND 200
I-Wave: I-Duble Wave
PCB Ububanzi: Max250mm
Umthamo wetanki ye-tin: 180-200KG
Ukufudumala: 450mm
Ukuphakama kwamaza: 12mm
PCB Conveyor Height (mm): 750±20mm
Amandla okuqalisa: 9KW
Amandla okusebenza: 2KW
Amandla eTanki yeTin: 6KW
Amandla okufudumeza: 2KW
Amandla eMoto: 0.25KW
Indlela yokulawula: Isikrini sokuchukumisa
Ubungakanani bomatshini: 1400 * 1200 * 1500mm
Ubungakanani bokupakisha: 2200 * 1200 * 1600mm
Isantya sokuTshintshela: 0-1.2m / min
Iindawo zokufudumeza: Ubushushu begumbi-180℃
Indlela yokufudumeza: Umoya oshushu
Indawo yokupholisa: 1
Indlela yokupholisa: I-Axial fan
Ubushushu beSolder: Ubushushu beGumbi—300℃
Umkhomba-ndlela wokudlulisa: Ekhohlo→Ekunene
Ulawulo lobushushu: PID+SSR
Ulawulo lomatshini: Mitsubishi PLC + Isikrini sokuchukumisa
Umthamo wetanki yeFlux: Max 5.2L
Indlela yokutshiza: Inyathelo leMotor+ST-6
Amandla: 3 isigaba 380V 50HZ
Umthombo womoya: 4-7KG/CM2 12.5L/Min
Ubunzima: 350KG
Ixesha lokuposa: Jun-29-2023