I. Iphedi iyadibana
1. Ukudityaniswa kweepads (ukongeza kwi-surface pads pads) kuthetha ukuba ukugqithelana kwemingxunya, kwinkqubo yokugaya kuya kukhokelela kwi-drill bit eqhekekileyo ngenxa yokomba kaninzi kwindawo enye, okubangela umonakalo kumngxuma.
2. Ibhodi ye-Multilayer kwimingxuma emibini i-overlap, enjengomngxuma we-disk yokuhlukanisa, omnye umngxuma we-disk yokudibanisa (iintyatyambo zeentyatyambo), ukwenzela ukuba emva kokuzoba intsebenzo engalunganga ye-disk yokuhlukanisa, okubangelwa yi-scrap.
II.Ukusetyenziswa kakubi komgangatho wegrafiki
1. Kwezinye imizobo umaleko ukwenza uxhulumaniso engenamsebenzi, ekuqaleni ibhodi ezine umaleko kodwa eyilwe ngaphezu kwamaleko ezintlanu umgca, ukuze unobangela wokungaqondi.
2. Uyilo ukugcina ixesha, isoftware Protel, umzekelo, kuzo zonke iileya zomgca kunye umaleko weBhodi ukuzoba, kunye umaleko weBhodi ukukrwela umgca ileyibhile, ukuze xa idatha umzobo ukukhanya, ngenxa yokuba umaleko weBhodi ayikhethwanga, uphoswe udibaniso kunye nekhefu, okanye iya kuba elifutshane-circuited ngenxa yokukhetha umaleko weBhodi yomgca ileyibhile, ngoko uyilo ukugcina ingqibelelo umaleko yemizobo kwaye ecacileyo.
3. Ngokuchasene noyilo oluqhelekileyo, olufana noyilo lwecandelo lomphezulu kwi-Bottom layer, i-welding surface design kwi-Top, ebangela ukuphazamiseka.
III.Ubume bokubekwa kwesiphithiphithi
1. Iiphedi zekhava yeempawu ze-SMD solder lug, kwibhodi eprintiweyo ngovavanyo kunye nokuphazamiseka kwecandelo le-welding.
2. Uyilo lomlinganiswa luncinci kakhulu, lubangela ubunzima kwiumatshini womshicileli wesikriniukuprinta, kukhulu kakhulu ukwenza abalinganiswa bajongane, kunzima ukwahlula.
IV.Isetingi zokuvula iphedi enecala elinye
1. Iipads ezinecala elilodwa ngokuqhelekileyo aziqhelwanga, ukuba umngxuma ufuna ukumakishwa, ukuvuleka kwayo kufuneka kulungiselelwe kwi-zero.Ukuba ixabiso lenzelwe ukuba xa idatha yokugaya yenziwe, esi sikhundla sibonakala kwiindlela zokudibanisa umngxuma, kunye nengxaki.
2. Iiphedi ezicalanye ezifana nokubhola kufuneka ziphawulwe ngokukodwa.
V. Ngebloko yokuzalisa ukuzoba iipads
Nge-filler block block pad kuyilo lomgca unokudlula isheke ye-DRC, kodwa ukusetyenzwa akunakwenzeka, ngoko ke ipadi yeklasi ayikwazi ukuvelisa ngokuthe ngqo idatha yokumelana ne-solder, xa kwi-solder ukumelana, indawo yebhloko yokugcwaliswa iya kugutyungelwa. ukuxhathisa i-solder, okukhokelela kubunzima bokuthengisa isixhobo.
VI.Uluhlu lomhlaba wombane lukwayintyatyambo yeentyatyambo kwaye ixhunywe kumgca
Ngenxa yokuba umbane owenziweyo owenziwe njengendlela yeentyatyambo, umgangatho womhlaba kunye nomfanekiso wangempela kwibhodi eprintiweyo ichasene, yonke imigca yokudibanisa imigca yodwa, leyo umyili kufuneka acace kakhulu.Apha, ngendlela, ukuzoba amaqela aliqela amandla okanye umgca wokwahlulwa komhlaba amaninzi kufuneka ulumke ungashiyi umsantsa, ukuze amaqela amabini amandla ombane omfutshane, kwaye anokubangela udibaniso lwendawo luvalwe (ukuze iqela le-short-circuit). amandla ahluliwe).
VII.Inqanaba lokucubungula alichazwanga ngokucacileyo
1. Uyilo lwephaneli enye kwi-TOP layer, njengokungongezwa kwenkcazo ye-positive kunye ne-negative do, mhlawumbi yenziwe ngebhodi exhonywe kwisixhobo kwaye i-welding ilungile.
2. umzekelo, ibhodi yoyilo lwebhodi emine usebenzisa i-TOP mid1, i-mid2 ephantsi imigangatho emine, kodwa ukucwangciswa akubekwe kulo myalelo, okufuna imiyalelo.
VIII.Uyilo lwebhloko yokugcwalisa kakhulu okanye ibhloko yokuzalisa ngokuzaliswa komgca omncinci kakhulu
1. Kukho ukulahleka kwedatha yokudweba ukukhanya eyenziwe, idatha yokudweba ukukhanya ayigqibekanga.
2. Ngenxa yokuba ibhloko yokuzalisa kwi-light drawing data processing isetyenziselwa umgca ngomgca ukudweba, ngoko ke inani ledatha yokukhanya eveliswayo likhulu kakhulu, landisa ubunzima bokucubungula idatha.
IX.Iphedi yesixhobo sokunyusa umphezulu imfutshane kakhulu
Le yeyokutyhutyha kunye novavanyo, kwisixhobo esixineneyo kakhulu sokukhwela umphezulu, isithuba phakathi kweenyawo zayo zombini sincinci kakhulu, iphedi ikwabhityile kakhulu, inaliti yovavanyo lofakelo, kufuneka ibe phezulu nasezantsi (ekhohlo nasekunene) indawo egxadazayo, njengoyilo lwephedi lufutshane kakhulu, nangona aluchaphazeli ufakelo lwesixhobo, kodwa luyakwenza inaliti yovavanyo ingalunganga ingavuleki indawo.
X. Isithuba segridi yendawo enkulu sincinci kakhulu
Ukuqulunqwa komgca wegridi yendawo enkulu kunye nomgca phakathi komphetho uncinci kakhulu (ngaphantsi kwe-0.3mm), kwinkqubo yokuvelisa ibhodi yesekethe eprintiweyo, inkqubo yokudlulisa umfanekiso emva kokuphuhliswa kwesithunzi kulula ukuvelisa ifilimu eninzi eyaphukileyo. iqhotyoshelwe ebhodini, ibangele imigca ephukileyo.
XI.Ifoyile yobhedu yendawo enkulu ukusuka kwisakhelo sangaphandle somgama sisondele kakhulu
Indawo enkulu ifoyile yobhedu ukusuka kwisakhelo sangaphandle kufuneka ubuncinane 0.2mm isithuba, kuba kwimilo lokusila, ezifana lokusila kwifoyile yobhedu kulula ukuba kubangele ifoyile yobhedu warping kwaye kubangelwa yingxaki ukuxhathisa solder off.
XII.Ubume boyilo lomda alucacanga
Abanye abathengi kwi-Gcina umaleko, umaleko weBhodi, umphezulu phezu komaleko, njl.njl. bayilwe umgca wemilo kwaye le migca yemilo ayidibani, ibangela ukuba abavelisi be-PCb kube nzima ukumisela ukuba ngowuphi umgca wemilo oza kulawula.
XIII.Uyilo lwegraphic olungalinganiyo
Umaleko weplating ongalinganiyo xa ukufakwa kwemizobo kuchaphazela umgangatho.
XIV.Indawo yokubeka ubhedu inkulu kakhulu xa kusetyenziswa imigca yegridi, ukuphepha i-SMT blistering.
Ixesha lokuposa: Jan-07-2022