Hlaziya kwakhonai-oveniyeyona nkqubo iphambili iteknoloji kwi-SMT, umgangatho we-reflow soldering ngundoqo wokuthembeka, ichaphazela ngokuthe ngqo ukuthembeka komsebenzi kunye neenzuzo zezoqoqosho zezixhobo ze-elektroniki, kunye nomgangatho we-welding ixhomekeke kwindlela ye-welding esetyenzisiweyo, izinto zokuwelda, iteknoloji yenkqubo ye-welding kunye ne-welding. izixhobo.
Yintoni iUmatshini wokuthengisa we-SMT?
I-Reflow soldering yenye yeenkqubo ezintathu eziphambili kwinkqubo yokubeka.I-Reflow soldering isetyenziselwa ukuthengisa ibhodi yesekethe ethe yaxhonywa amacandelo, ixhomekeke ekufudumezeni ukunyibilikisa i-solder paste ukwenza amacandelo e-SMD kunye neebhodi zebhodi yesekethe i-pads fusion welding kunye, kwaye emva koko ngokupholisa i-soldering yokupholisa ukupholisa i-solder paste. qinisa amacandelo kunye neepads kunye.Kodwa uninzi lwethu luyawuqonda umatshini wokuphinda udibanise, oko kukuthi, ngokuphinda kufakwe i-soldering i-PCB ibhodi yebhodi ye-welding igqityiwe umatshini, okwangoku luluhlu olubanzi kakhulu lwezicelo, ngokusisiseko uninzi lwefektri yombane iya kusetyenziswa, ukuqonda i-reflow soldering, okokuqala. ukuqonda inkqubo ye-SMT, ngokuqinisekileyo, ngokwemigaqo ye-layman yi-weld, kodwa inkqubo ye-welding reflow soldering ibonelelwa ngobushushu obufanelekileyo, oko kukuthi, i-curve yeqondo lokushisa.
Indima ye-oven yokubuyisela kwakhona
Indima yokubuyisela kwakhona ngamacandelo e-chip afakwe kwibhodi yesekethe ethunyelwe kwigumbi lokuphinda, emva kokuba ubushushu obuphezulu busetyenziselwe ukuthengisa amacandelo e-chip yentlama ye-solder ngobushushu obuphezulu bomoya oshushu ukwenza inkqubo yokutshintsha ubushushu bunyibilike, ukuze amacandelo etshiphu kunye neepadi zebhodi yesekethe zidityanisiwe, emva koko zipholile kunye.
Iimpawu zetekhnoloji ye-Reflow soldering
1. Amalungu axhomekeke kumothuko omncinci we-thermal, kodwa ngamanye amaxesha anike isixhobo uxinzelelo olukhulu lobushushu.
2. Kuphela kwiindawo ezifunekayo zokusetyenziswa kwe-solder paste, inokulawula inani le-solder paste application, inokuphepha ukuveliswa kweziphene ezifana ne-bridging.
3. Uxinzelelo lomphezulu we-solder etyhidiweyo inokulungisa ukuphambuka okuncinci kwendawo yokubeka yamacandelo.
4. Umthombo wokufudumala wendawo ungasetyenziselwa ukwenzela ukuba iinkqubo ezahlukeneyo ze-soldering zingasetyenziselwa ukudibanisa kwi-substrate efanayo.
5. Ukungcola ngokuqhelekileyo akuxutywanga kwi-solder.Xa usebenzisa i-solder paste, ukubunjwa kwe-solder kunokugcinwa ngokuchanekileyo.
NeoDen IN6Hlaziya iimpawu ze-oveni
Ulawulo lwe-Smart kunye ne-sensor yeqondo lokushisa eliphezulu, ubushushu bunokuzinza ngaphakathi kwe- + 0.2 ℃.
Umbane wasekhaya, uluncedo kwaye uyasebenza.
I-NeoDen IN6 ibonelela nge-solder esebenzayo yokubuyisela kwakhona kubavelisi be-PCB.
Imodeli entsha igqithise imfuno yokufudumala kwe-tubular, ebonelela ngokusasazwa kweqondo lokushisayonke i-oven yokubuyisela.Ngokuthengisa iiPCBs nakwiconvection, onke amacandelo afudunyezwa ngesantya esifanayo.
Ubushushu bunokulawulwa ngokuchaneka okugqithisileyo—abasebenzisi banokubona ubushushu ngaphakathi kwe-0.2°C.
Uyilo lusebenzisa ipleyiti yokufudumeza kwe-aluminium ialloy eyandisa amandla okusebenza kakuhle kwenkqubo.Inkqubo yokucoca umsi yangaphakathi iphucula ukusebenza kwemveliso kwaye inciphisa imveliso eyingozi, nayo.
Ixesha lokuposa: Sep-07-2022