Reflow soldering machineinenkqubo elungileyo, akukho mfuneko zikhethekileyo kuyilo lwamacandelo indawo, isalathiso kunye nesithuba.I-Reflow soldering surface components layout ikakhulu iqwalasela i-solder paste yoshicilelo lokushicilela ifestile evulekileyo kwiimfuno zezithuba zecandelo, khangela kwaye ubuyele kwiimfuno zendawo yokulungisa, iimfuno zenkqubo yokuthembeka.
1.Izixhobo zokuxhoma phezu komhlaba ezingavumelekanga indawo yelaphu.
Icala lothumelo (elingqamene nelathiso lothumelo), umgama ukusuka kwicala le-5mm kuluhlu aluvumelekanga indawo yelaphu.I-5mm luluhlu olunokuthi zonke izixhobo ze-SMT zivume.
Icala elingenalo ukuthutha (icala elijongene necala lokuthutha), i-2 ~ 5mm ububanzi ukusuka kwicala elingavumelekanga.Ngokwethiyori, amacandelo anokuthi abekwe kumda, kodwa ngenxa yesiphumo somda we-stencil deformation, indawo engekho-layout ye-2 ~ 5mm okanye ngaphezulu kufuneka isekwe ukuqinisekisa ukuba ubukhulu be-solder paste buhlangabezana neemfuno.
Icala lothumelo lwendawo engacwangciswanga ayinakubekwa ngaphandle naluphi na uhlobo lwamacandelo kunye neepads zabo.Icala elingathumeliyo lendawo engacwangciswanga ithintela ubukhulu becala uyilo lwezixhobo zokuxhoma umphezulu, kodwa ukuba ufuna ukuyila iinxalenye zekhatriji, kufuneka ziqwalaselwe ukuthintela ukuthengiswa kwamaza okuya phezulu kwiimfuno zenkqubo yesixhobo se-flip tin.
2.Amacandelo kufuneka abe rhoqo kangangoko kunokwenzeka ukulungiselela.I-Polarity yamacandelo e-polepositive pole, i-IC gap, njl.
3.Amacandelo abekwe ngokulinganayo kangangoko kunokwenzeka.Unikezelo olufanayo lunceda ekunciphiseni umahluko lobushushu ebhodini xa reflow soldering, ingakumbi ubukhulu BGA, QFP, PLCC centralized ubeko, kuya kubangela PCB lendawo ubushushu eliphantsi.
I-4.Isithuba phakathi kwamacandelo (ikhefu) sinxulumene ngokukodwa neemfuno zendibano kunye nokusebenza kwe-welding, ukuhlolwa, indawo yokuphinda isebenze, njl., ingabhekisela ngokubanzi kwimigangatho yoshishino.Ngeemfuno ezikhethekileyo, ezifana nesithuba sokunyuka kwe-heat sink kunye nesithuba sokusebenza kwizihlanganisi, nceda uyila ngokweemfuno zangempela.
Iimpawu ze NeoDen IN12C
I-1.Inkqubo yokulawula ineempawu zokudibanisa okuphezulu, ukuphendula ngexesha elifanelekileyo, izinga lokungaphumeleli eliphantsi, ukugcinwa lula, njl.
I-2.Uyilo olulodwa lwemodyuli yokufudumala, kunye nokulawulwa kweqondo lokushisa elichanekileyo, ukusabalalisa ukushisa okufanayo kwindawo yembuyekezo ye-thermal, ukusebenza okuphezulu kwembuyekezo ye-thermal, ukusetyenziswa kwamandla aphantsi kunye nezinye iimpawu.
3.Ingakwazi ukugcina iifayile ezisebenzayo ezingama-40.
4.Up ukuya 4-indlela real-time ukubonisa PCB ibhodi umphezulu welding ijiko lobushushu.
I-5.i-lightweight, i-miniaturization, i-design ye-industrial eyingcali, iimeko zesicelo eziguquguqukayo, ezinobuntu.
I-6.Ukugcinwa kwamandla, ukusetyenziswa kwamandla aphantsi, iimfuno zombane ophantsi, umbane oqhelekileyo oqhelekileyo unokuhlangabezana nokusetyenziswa, xa kuthelekiswa neemveliso ezifanayo ngonyaka unokugcina iindleko zombane kwaye emva koko uthenge iyunithi ye-1 yale mveliso.
Ixesha lokuposa: Aug-03-2022