processing SMT iya kubonakala ezinye iingxaki ezikumgangatho ombi, ezifana emile lesikhumbuzo, nkqu inkonkxa, solder engenanto, solder lobuxoki, njl. Kukho izizathu ezininzi kumgangatho ophantsi, ukuba kukho imfuneko uhlalutyo oluthile lweengxaki ezithile.
Namhlanje kunye nawe ukwazisa ushicilelo lwe-SMT nokuba tin oonobangela kunye nezisombululo.
Yintoni i-SMT netoti?
Ukusuka kwintsingiselo yokoqobo yengqikelelo yetoti inokuqondwa kakuhle, kuqikelelwa ukuba iipads ezikufutshane zivela kwitoti engaphezulu, ukubunjwa koqhagamshelo, iipads ezahlukeneyo okanye imigca, ngetoti engaphezulu edityaniswe kunye, eyaziwa ngokuba yibhulorho yetin.
Oku kulandelayo yi-SMT nezizathu ze-tin kunye nokuphucula amanyathelo okuthintela:.
1.Ukubambelela kakubi kwe-solder paste
I-Solder paste yenziwe nge-tin powder kunye nendibaniselwano ye-flux, kwi-inpacked phambi kokusetyenziswa iya kufakwa efrijini, xa imfuneko yokusetyenziswa, kuyimfuneko ukufudumeza kwaye ivuselele ngokulinganayo kwangaphambili, ibonakale nkqu i-tin ngenxa ye-viscosity embi. of intlama, inokuba umva lobushushu okanye ukuvuselela ixesha akwanelanga.
Amanyathelo okuphucula
Ngaphambi kokusetyenziswa, fudumeza i-paste ngaphezu kwemizuzu engama-30 kwaye ugxobhoze ngokulinganayo de i-paste ayiphuli.Iifektri ezininzi nangakumbi ngoku zisebenzisa iikhabhathi zolawulo lwe-solder paste ezikrelekrele, ezinokuphucula ngempumelelo le ngxaki.
2.Ukuvulwa kwestencil akuchanekanga ngokwaneleyo
Istencil kufuneka isetyenziselwe ukuchwetheza, istencil eneneni kukuvuza kwepcb pad, kufuneka yenziwe ngobungakanani bepedi yepcb kunye nobukhulu, indawo, iziphene ezithile zemveliso yestencil, kunokubakho ukuvuleka okukhulu kakhulu, okukhokelela ekuvuzeni kwesixa incama ye-solder eprintiweyo kakhulu, kukho utshintsho lokuncamathelisa olukhokelela kwitoti elinganayo.
Uphuculo lokuchasa amanyathelo
I-stencil kufuneka ihlolwe ngokucophelela ngokubhekiselele kwifayile yeGerber, kwaye i-laser kufuneka isetyenziswe ukuvula i-stencil, ngelixa ukuvulwa kwe-stencil (ingakumbi kwiipads ezinezikhonkwane) kufuneka kube yikota encinci kuneyona pad.
3.Umatshini wokuprinta we-Solderushicilelo, ibhodi ye-pcb ibonakala ikhululekile
PCB pads ukuprinta paste solder, imfuneko yokusebenzisa solder paste umatshini woshicilelo, solder paste umatshini woshicilelo inetafile PCB solder intlama yoshicilelo kunye demoulding, kwi PCB pad solder paste yoshicilelo, PCB kufuneka ukudluliselwa kwitafile indawo ekhankanyiweyo, kwaye imfuno fixture esisigxina pcb ibhodi, ukuba ukutenxa isikhundla transfer, fixture ayizange ibambe pcb, iya kuvela printing offset, ukuvelisa nkqu inkonkxa.
Amanyathelo okuphucula
Xa uprinta i-solder paste kumshicileli we-solder paste, kufuneka ulungise inkqubo kwangaphambili ukuze indawo yokudlulisa i-pcb ichanekile, kwaye ukulungiswa kufuneka kuhlolwe rhoqo kwaye kufakwe endaweni yolondolozo.
Le miba ingasentla, ukuze uthintele ukwenzeka kwetoti kunye nolunye umgangatho ombi, kufuneka wenze umsebenzi olungileyo kungqinisiso lwangethuba, kodwa nangasemva komatshini wokushicilela ukongeza aUmatshini we-SMT SPI ukufumanisa, kangangoko kunokwenzeka ukunciphisa izinga elibi.
Iimpawu zeNeoDen ND1umshicileli westencil
Dlulisa umkhombandlela eKhohlo – Ekunene, Ekunene – Ekhohlo, Ekhohlo – Ekhohlo, Ekunene – Ekunene
Imowudi yothumelo Icandelo lohlobo lwengoma
Imowudi yokubamba yePCB
Uxinzelelo lweSoftware oluhlengahlengiswayo loxinzelelo lwecala elastiki
Ukhetho:
1. Ivacuum yegumbi lokufunxa lilonke
2. Ivacuum esezantsi yeengongoma ezininzi
3. Ipleyiti yokudibanisa isitshixo seEdge
Indlela yenkxaso yebhodi Umthinjana weMagnetic, isixhobo sokubamba umsebenzi okhethekileyo (ukhetho: Igridi-Lok)
Ixesha lokuposa: Feb-02-2023