Izinto eziNcedisayo zeMveliso ye-SMT yeminye iMigaqo eqhelekileyo

Kwinkqubo yokuvelisa ukubekwa kwe-SMT, kudla ngokuyimfuneko ukusebenzisa i-SMD yokunamathela, i-solder paste, i-stencil kunye nezinye izinto ezincedisayo, ezi zixhobo ezincedisayo kwi-SMT yonke inkqubo yokuvelisa indibano, umgangatho wemveliso, ukusebenza kakuhle kwemveliso kudlala indima ebalulekileyo.

1. Ixesha lokugcina (uBomi beShelf)

Ngaphantsi kweemeko ezichaziweyo, izinto eziphathekayo okanye imveliso isengakwazi ukuhlangabezana neemfuno zobugcisa kunye nokugcina ukusebenza okufanelekileyo kwexesha lokugcina.

2. Ixesha lokubeka (ixesha lokusebenza)

I-Chip adhesive, i-solder paste esetyenziswayo phambi kokuvezwa kwindawo echaziweyo isenokuthi igcine imichiza echaziweyo kunye neempawu zomzimba zexesha elide.

3. I-Viscosity (I-Viscosity)

I-chip adhesive, i-solder paste kwi-drip yendalo yeempawu zokuncamathelisa ukulibaziseka kokuwa.

4 Thixotropy (Thixotropy Ratio)

I-Chip adhesive kunye ne-solder paste ineempawu zolwelo xa ikhutshwe phantsi koxinzelelo, kwaye ngokukhawuleza ibe yiplastiki eqinile emva kokukhupha okanye ukuyeka ukufaka uxinzelelo.Olu phawu lubizwa ngokuba yi-thixotropy.

5. Ukutyibilika (Ukutyibilika)

Emva koshicilelo lweumshicileli westencilngenxa yomxhuzulane kunye noxinzelelo lomphezulu kunye nokunyuka kwamaqondo obushushu okanye ixesha lokupaka lide kakhulu kunye nezinye izizathu ezibangelwa kukuncipha kobude, indawo engezantsi ngaphaya komda ochaziweyo wesiganeko sokudodobala.

6. Ukusasaza

Umgama ukuba i-adhesive isasazeka kwindawo yokushisa emva kokukhupha.

7. Ukuncamathela (ITaki)

Ubungakanani bokunamathela kwi-solder paste kumacandelo kunye nokuguqulwa kokubambelela kwayo kunye nokutshintsha kwexesha lokugcina emva kokuprintwa kwe-solder paste.

8. Ukuchama (Ukumanzisa)

I-solder etyhidiweyo kumphezulu wobhedu ukwenza iyunifomu, imo egudileyo kwaye ingaqhawukiyo ye-solder ebhityileyo.

9. Intlama yeSolder engacocekanga (No-clean Solder Paste)

Intlama ye-Solder equlethe kuphela intsalela ye-solder engenabungozi emva kokuxutywa ngaphandle kokucoca i-PCB.

10. Intlama yeSoda yoBubushushu obuphantsi (Incama yoBubushushu obuphantsi)

Intlama yeSolder enobushushu obunyibilikayo obungaphantsi kwe-163℃.