Ukuhlolwa kwe-SPI yinkqubo yokuhlola iteknoloji yokucubungula i-SMD, eyona nto ibona umgangatho wokuprinta i-solder paste.
Igama elipheleleyo lesiNgesi le-SPI nguHlolo lwe-Solder Paste, umgaqo wayo uyafana ne-AOI, zifumaneka ngokufumana amehlo kwaye emva koko kuveliswe imifanekiso ukumisela umgangatho wayo.
Umgaqo wokusebenza weSPI
Kwimveliso yobuninzi be-pcba, iinjineli ziya kuprinta iibhodi ezimbalwa ze-pcb, i-SPI ngaphakathi kwikhamera yomsebenzi iya kuthabatha imifanekiso ye-PCB (ukuqokelelwa kwedatha yoshicilelo), emva kokuba i-algorithm ihlalutya umfanekiso oveliswa yi-interface yomsebenzi, kwaye emva koko uqinisekise ngokubonakalayo ukuba ulungile.ukuba kulungile, iya kuba yibhodi yoshicilelo lwedatha ye-solder yokushicilela njengomgangatho wereferensi yemveliso yobuninzi eyalandelayo iya kusekelwa kwidatha yoshicilelo ukwenza isigwebo!
Kutheni ukuhlolwa kwe-SPI
Kumashishini, ngaphezu kwe-60% yeziphene ze-soldering zibangelwa ukuprintwa kwe-solder paste embi, ngoko ukongeza itshekhi emva kokuprinta kwe-solder paste kunokuba emva kweengxaki ze-soldering kwaye ubuyele kwi-union ukugcina iindleko.Ngenxa yokuba ukuhlolwa kwe-SPI kufunyenwe kakubi, unako ngokuthe ngqo kwisikhululo sokumisa ukuba uthathe i-pcb embi, uhlambe i-solder pads kwi-pads inokuphinda iprintwe, ukuba umva we-soldering ulungiswe kwaye ufunyenwe, ngoko kufuneka usebenzise intsimbi. ukulungisa okanye nokulahla.Xa sithetha, unokonga iindleko
Zeziphi izinto ezimbi ezibonwa yi-SPI
1. I-solder uncamathisele printing offset
I-Solder Cola printing offset iya kubangela ukuma kwesikhumbuzo okanye i-welding engenanto, ngenxa yokuba i-solder paste i-offset enye ekupheleni kwe-pad, kwi-soldering ubushushu bunyibilika, iziphelo ezimbini ze-solder paste ubushushu zinyibilika ziya kubonakala umahluko wexesha, zichatshazelwa luxinzelelo, esinye isiphelo. isenokujijwa.
2. I-solder paste yokuprinta ukucaca
I-Solder paste yoshicilelo flatness ibonisa ukuba i-pcb pad surface solder intlama ayikho tyaba, i-tin engaphezulu kwelinye icala, i-tin encinci kwelinye icala, iya kubangela isiphaluka esifutshane okanye umngcipheko wokuma isikhumbuzo.
3. Ukutyeba kokuprintwa kwe-solder paste
I-Solder Cola yoshicilelo ubukhulu incinci kakhulu okanye ininzi kakhulu i-solder paste ukuprinta ukuvuza, kuya kubangela umngcipheko we-solder engenanto.
4. I-Solder incamathelise ukuprinta ukuba utsale incam
I-Solder Cola yoshicilelo ingcebiso yokutsala kunye ne-solder paste flat iyafana, kuba incama ye-solder emva kokushicilela ukukhulula ukungunda, ukuba ngokukhawuleza kakhulu kuyacotha kunokuvela i-tip.
Iinkcukacha zoMashini we-NeoDen S1 SPI
Inkqubo yokudluliselwa kwePCB: 900±30mm
Ubungakanani obuncinci bePCB: 50mm×50mm
Ubungakanani obukhulu bePCB: 500mm×460mm
PCB ubukhulu: 0.6mm ~ 6mm
Plate edge clearance: phezulu: 3mm phantsi: 3mm
Isantya sokutshintshela: 1500mm/s (MAX)
Imbuyekezo yokugoba ipleyiti: <2mm
Izixhobo zomqhubi: Inkqubo ye-AC servo motor
Ukumisela ukuchaneka: <1 μm
Isantya sokuhamba: 600mm/s
Ixesha lokuposa: Jul-20-2023