X-reyi:Igama elipheleleyo leIzixhobo zovavanyo lweX-reyi, kukusetyenziswa kwe-X-reyi yamandla aphantsi, umfanekiso wokuskena wemveliso yangaphakathi, ukufumanisa iintanda zangaphakathi, imizimba yangaphandle kunye nezinye iziphene.Yiloo ndlela izibhedlele ezenza ngayo iX-reyi.
Ubukrelekrele kunye ne-miniaturization yeemveliso ze-elektroniki zenza ubungakanani beetshiphusi zibe zincinci kwaye zincinci, kodwa ngakumbi nangakumbi izikhonkwane, ngakumbi inani elikhulu lezicelo ze-BGA kunye ne-IC kumaziko athile.Ngenxa yobuchule bokupakishwa, imeko ye-welding yangaphakathi ye-chip inokubonwa kuphela ngezixhobo, kwaye ubhaqo lwenkqubo yombono wobukrelekrele eqhelekileyo ayinako ukuchonga ngokusisiseko umgangatho wamalungu e-solder.Ukuhlolwa okubonakalayo okwenziwa ngokwenziwa lolona khetho luchanekanga luncinci kwaye luphinde luveliswe kwimeko yeendawo ezixineneyo ze-solder, kwaye eyona ndlela ilungileyo kukwenza uhlolo lwebhetshi ye-X-ray.
Imiyalelo engxamisekileyo, ubungqina obukhawulezayo bufuna izixhobo ezininzi zokubona.Itekhnoloji yokufumanisa i-X-reyi isetyenziswa ngokubanzi kuhlolo lwekhwalithi ye-welding ye-BGA emvareflow oveni-welding, i-qualitative and quantitative risk analysis of joints solder, ukungaqhelekanga komgangatho ofunyenweyo, ukulungiswa ngexesha elifanelekileyo.Ngokwesishwankathelo kunye nohlalutyo lwamatyala okusebenza kwethiyori, ukuchaneka kokuhlolwa kwe-X-ray ngaphakathi kwe-BGA ye-solder joints kunokugqithisa i-15% ye-ICT yokufumanisa i-ICT ye-manual, kwaye ukusebenza kakuhle kungaphezulu kwe-50%.
Kwi-scope yesicelo, izixhobo azikwazi ukuchonga iziphene ze-welding kwi-BGA (ezifana ne-welding engenanto, i-welding ye-virtual), kodwa inokuskena kwaye ihlalutye iinkqubo ze-microelectronic kunye nezinto zokutywinwa, iintambo, izixhobo, iplastiki yangaphakathi, njl.
Umatshini wokuhlola i-NeoDen X-Ray
Inkcazo yoMthombo weX-Ray:
Uhlobo olutywiniweyo lweMicro-Focus X-Ray Tube
Uluhlu lombane 40-90KV
Uluhlu lwangoku 10-200 μA
Ubuninzi beZiphumo zamandla 8 W
Micro Focus Spot Ubungakanani 15μm
Inkcazo yesichongi sephaneli ecaba:
Uhlobo lwe-TFT Industrial Dynamic FPD
I-Pixel Matrix 768×768
Indawo yokujonga 65mm×65mm
Isisombululo 5.8Lp/mm
Isakhelo (1×1) 40fps
A/D Conversion bit 16bits
Imilinganiselo: L850mm×W1000mm×H1700mm
Amandla oNgeniso: 220V 10A/110V 15A 50-60HZ
Ubungakanani beSampuli enkulu: 280mm×320mm
Inkqubo yokulawula I-PC yeShishini WIN7/ WIN10 64bits
Ubunzima obuninzi malunga: 750KG
Ixesha lokuposa: Nov-04-2021