Ukusetyenzwa kwe-SMD kuqala kufuneka kukhuhlwe umaleko we-solder paste phezu kwe-pcb pad, ukuprintwa kwe-solder paste kufuneka kwenziwe emva komgangatho wovavanyo, ukuvavanya igama lomatshini ubizwa ngokuba yi-spi (umatshini wovavanyo we-solder paste), eyona nto iphambili. uvavanyo loshicilelo uncamathisele solder ukuba kukho offset, tsala incam, ubukhulu kunye flatness, njalo njalo, kuba umgangatho solder paste yoshicilelo kuchaphazela ngqo umgangatho womgangatho weld ngasemva, ishishini weld isizathu amahlwempu. ngaphezu kwe-60% yeengxaki kukuprintwa kwe-solder paste!Ibangelwa ngaphezu kwe-60% yezizathu zokubethelwa kakubi kwishishini leengxaki zoshicilelo lwe-solder paste, ngokwaneleyo ukubonisa ukuba kubaluleke kangakanani uvavanyo lokuprinta ukushicilela i-solder.
Intsingiselo yeSPI ngereyithi
Solder Paste Printing Inspection (SPI) kunye novavanyo lwe-AOI lunomlinganiselo othe ngqo, ngokuthe ngqo kwiqondo elisuka kwigama linokuqondwa kakuhle, ngokuthe ngqo ngokunokwenzeka, linokuba lizinga lempumelelo, okukhona kuthe ngqo kumlinganiselo, kokukhona imveliso iphezulu. kunye nomthamo wemveliso, ukuba i-straight through rate iphantsi, ithetha ukuba inkqubo ayisebenzi, echaphazela amandla okusebenza kakuhle.
Ukubaluleka kokuthe ngqo ngolawulo lwezinga
Ngokuthe tye ngokusebenzisa izinga likwabonisa izinga lempumelelo, okukhona kuthe tye ngomlinganiselo, kokukhona umgangatho wobugcisa bemveliso uphezulu, amathuba okudlula ngokuthe ngqo, kwaye akusoloko kuxela okubi okanye okungalunganga, ngokuthe ngqo ngesantya siphezulu, imveliso ephezulu, umthamo ophezulu, ngqo ngokusebenzisa izinga liphantsi, ukunqongophala iteknoloji imveliso, kwaye kuya kuchaphazela ukusebenza kakuhle imveliso kunye neendleko zexesha, kodwa ngokungangqalanga kukhokelela iindleko zabasebenzi ngaphezulu, iindleko eziphathekayo ukugcinwa.Ngoko ke, ulawulo oluthe ngqo lwesantya sesityalo sokulungisa alubonisi nje umgangatho womgangatho wemveliso, kodwa lunxulumene nokusebenza kakuhle kwemveliso.
Izinto ezichaphazela i-spi ngereyithi
Intlama yeSolder
Ukuba i-liquidity ye-solder paste inkulu kakhulu, kulula ukubangela ukuba intlama ye-solder itshintshe kwaye iwe phantsi kwi-pad, ibangele ushicilelo olubi, kufuneka sisebenzise i-solder paste ukuze sibuyele ngokupheleleyo kwiqondo lokushisa kunye nokuvuselela.
Squeegee
Uxinzelelo lwe-Squeegee, isantya, i-angle iya kuchaphazela inani le-solder paste eprintiweyo kwi-pcb pad (ubukhulu kunye ne-flatness), ukuba ubukhulu bukhulu kakhulu okanye buncinci, kuya kubangela isiphaluka esifutshane okanye i-solder engenanto.
Ubungakanani bomngxuma westencil kunye nokugudiswa kodonga lomngxuma kuya kuchaphazela i-solder paste seepage, kwaye ukuba udonga lomngxuma we-stencil luneenwele, kuya kuba lula ukubangela intsalela ye-solder paste.
Iimpawu zeNeoDen SPI Machine
Inkqubo yesoftware:
Inkqubo yokusebenza: Windows 7 Ultimate 64bit
1) Inkqubo yokuchonga:
Uphawu:Ikhamera ye-raster ye-3d (i-double iyakhethwa)
I-interface yokusebenza: Inkqubo yegraphical, kulula ukuyisebenzisa, inkqubo yesiTshayina kunye nesiNgesi tshintsha ngaphezulu
Ujongano: 2D KUNYE kunye nomfanekiso we-3D truecolor
AMANQAKU: Ungakhetha inqaku eli-2 lecommom
2) Inkqubo: Inkxaso yegerber, igalelo leCAD, ngaphandle kweintanethi kunye neprogram yencwadana
3) SPC
I-SPC engaxhunyiwe kwi-intanethi: Inkxaso
Ingxelo ye-SPC: Nanini na iNgxelo
Control Graphic: Umthamo, indawo, ukuphakama, offset
Thumela isiqulatho: Excel, umfanekiso(jpg,bmp)
Ixesha lokuposa: Aug-01-2023