Kwimveliso yePCBAUmatshini we-SMT, ukuqhekeka kwamacandelo e-chip kuqhelekileyo kwi-multilayer chip capacitor (MLCC), eyona nto ibangelwa uxinzelelo lwe-thermal kunye noxinzelelo lomatshini.
1. ISAKHIWO se-MLCC capacitors sibuthathaka kakhulu.Ngokuqhelekileyo, i-MLCC yenziwe nge-multi-layer ceramic capacitors, ngoko inamandla aphantsi kwaye kulula ukuchatshazelwa bubushushu kunye namandla omatshini, ngakumbi kwi-soldering wave.
2. Ngexesha lenkqubo ye-SMT, ukuphakama kwe-z-axis yekhetha kwaye ubeke umatshiniigqitywe ngobunzima bamacandelo e-chip, kungekhona ngenzwa yoxinzelelo, ngokukodwa kumatshini othile we-SMT ongenawo umsebenzi wokuhlalisa othambileyo we-z-axis, ngoko ke ukuqhekeka kubangelwa ukunyamezela kobunzima bamacandelo.
3. Uxinzelelo lwe-buckling ye-PCB, ngakumbi emva kwe-welding, inokubangela ukuqhekeka kwamacandelo.
4. Amanye amacandelo e-PCB anokonakala xa ahlulwa.
Amanyathelo othintelo:
Lungisa ngokucokisekileyo inkqubo ye-welding curve, ngakumbi ubushushu bendawo yokufudumeza akufanele bube buphantsi kakhulu;
Ukuphakama kwe-z-axis kufuneka kulungiswe ngononophelo kumatshini we-SMT;
Imilo yomsiki wejigsaw;
I-curvature ye-PCB, ngakumbi emva kwe-welding, kufuneka ilungiswe ngokufanelekileyo.Ukuba umgangatho we-PCB yingxaki, kufuneka ithathelwe ingqalelo.
Ixesha lokuposa: Aug-19-2021