- Kwinkqubo yephinda uqukunjelwei-oveni, amacandelo awafakwanga ngokuthe ngqo kwi-solder etyhidiweyo, ngoko ukutshitshiswa kwe-thermal kumacandelo amancinci (ngenxa yeendlela ezahlukeneyo zokufudumeza, uxinzelelo lwe-thermal kumacandelo luya kuba lukhulu kwiimeko ezithile).
- Ingakwazi ukulawula inani le-solder elisetyenziswe kwinkqubo ekhokelayo, ukunciphisa iziphene ze-welding ezifana ne-welding virtual, ibhulorho, ngoko umgangatho we-welding ulungile, ukuhambelana kwe-solder joint kulungile, ukuthembeka okuphezulu.
- Ukuba indawo echanekileyo yenkqubo ehamba phambili kwi-PCB yokuphosa i-solder kwaye ubeke indawo yamacandelo ibe nokutenxa okuthile, kwinkquboi-reflow solderingumatshini, xa zonke iinqununu zesiphelo se-welding, i-pin kunye ne-solder ehambelanayo yokumanzisa ngexesha elifanayo, ngenxa yempembelelo yoxinzelelo lwe-solder etyhidiweyo, ivelisa umphumo wokuqhelanisa, ukulungisa ngokuzenzekelayo ukutenxa, amacandelo abuyele ukulinganisa indawo ngqo. .
- SMT Reflowi-oveniyintlama ye-solder yorhwebo eqinisekisa ukubunjwa okuchanekileyo kwaye ngokubanzi ayixubeki kunye nokungcola.
- Umthombo wokufudumeza wendawo unokusetyenziswa, ngoko ke iindlela ezahlukeneyo ze-welding zingasetyenziselwa ukudibanisa kwi-substrate efanayo.
- Inkqubo ilula kwaye umsebenzi wokulungisa uncinci kakhulu.
Ixesha lokuposa: Mar-10-2021