1. IiPads.
Iphedi ngumngxuma wesinyithi osetyenziselwa ukuthengisa izikhonkwane zamalungu.
2. Umaleko.
Ibhodi yesekethe ngokwendlela yokuyila eyahlukileyo, kuya kubakho i-double-side, 4-layer board, 6-layer board, 8-layer board, njl. kukho ezinye zenkcazo yokucubungula kunye nomaleko.
3. Phezu komngxuma.
Intsingiselo yokugqobhoza kukuba ukuba isekethe ayinakufezekiswa kwinqanaba lalo lonke ulungelelwaniso lwesignali, kuyimfuneko ukudibanisa imigca yesiginali ngapha kweemaleko ngendlela yokugqobhoza, ukugqobhoza kukwahlulwe ngokubanzi kube ziindidi ezimbini, enye yentsimbi. ukubhoboza, enye ye-non-metallic perforation, apho i-metal perforation isetyenziselwa ukudibanisa izikhonkwane zamacandelo phakathi kweengqimba.Uhlobo lokugqobhoza kunye nobubanzi bomngxuma luxhomekeke kwiimpawu zomqondiso kunye neemfuno zenkqubo yesityalo sokulungisa.
4. Amacandelo.
Ithengiswa kumacandelo e-PCB, amacandelo ahlukeneyo phakathi kwendibaniselwano yolungelelwaniso inokufikelela kwimisebenzi eyahlukeneyo, kulapho indima yePCB.
5. Ulungelelwaniso.
Ukulungelelaniswa kubhekisela kwimigca yesignali phakathi kwezikhonkwane zezixhobo ezidibeneyo, ubude kunye nobubanzi bokulungelelaniswa buxhomekeke kubume besignali, njengobungakanani bangoku, isantya, njl., ubude kunye nobubanzi bokulungelelaniswa buyahluka.
6. Isikrini sesilika.
Ushicilelo lwescreen lusenokuthiwa umaleko woshicilelo lwesikrini, osetyenziselwa iintlobo ngeentlobo zezixhobo ezinxulumene nokuphawulwa kolwazi, ushicilelo lwesikrini lumhlophe ngokubanzi, unokukhetha umbala ngokweemfuno zabo.
7. Umaleko wokumelana ne-Solder.
Indima ephambili ye-soldermask layer kukukhusela umphezulu we-PCB, ukwenza umaleko okhuselayo kunye nobukhulu obuthile, kunye nokuthintela uqhagamshelwano phakathi kobhedu nomoya.I-Solder resistant layer iluhlaza ngokubanzi, kodwa kukho kwakhona ebomvu, etyheli, eluhlaza okwesibhakabhaka, emhlophe, i-solder emnyama yokuxhathisa iinketho zomaleko.
8. Indawo imingxuma.
Imingxuma yokubeka ibekwe ukwenzela ukuba kube lula ukufakela okanye imingxuma yokucoca.
9. Ukuzalisa.
Ukuzaliswa kusetyenziselwa umnatha womhlaba wokubeka ubhedu, kunokunciphisa ngokufanelekileyo i-impedance.
10. Umda wombane.
Umda wombane usetyenziselwa ukugqiba ubungakanani bebhodi, onke amacandelo ebhodi ayinakudlula umda.
Ezi nxalenye zingasentla ezilishumi zisisiseko sokubunjwa kwebhodi, iimpawu ezininzi okanye imfuneko yokutshisa kwi-chip ukufezekisa inkqubo.
Ixesha lokuposa: Jul-05-2022