Zeziphi Izisombululo kwiBhodi yokugoba yePCB kunye neBhodi yeWarping?

reflow ovenNeoDen IN6

1. Nciphisa ubushushu bereflow ovenokanye ulungise izinga lokufudumeza kunye nokupholisa kwepleyiti ngexeshaumatshini wokuphinda uphinde udibaniseukunciphisa ukwenzeka kokugoba kwepleyiti kunye ne-warping;

2. Ipleyiti ene-TG ephezulu inokumelana nobushushu obuphezulu, inyuse amandla okumelana noxinzelelo olubangelwa kubushushu obuphezulu, kwaye ngokuthelekisa, iindleko zezinto eziphathekayo ziya kwanda;

3. Ukwandisa ubukhulu bebhodi, oku kusebenza kuphela kwimveliso ngokwayo ayifuni ubukhulu beemveliso zebhodi ye-PCB, iimveliso ezikhaphukhaphu zingasebenzisa ezinye iindlela kuphela;

4. Ukunciphisa inani leebhodi kunye nokunciphisa ubungakanani bebhodi yesekethe, kuba ibhodi enkulu, ubukhulu obukhulu, ibhodi kwi-backflow yendawo emva kokufudumeza kobushushu obuphezulu, uxinzelelo lwengingqi luhluke, luchatshazelwa bubunzima bayo, lula. ukubangela ukuguqulwa koxinzelelo lwendawo phakathi;

5. I-tray fixture isetyenziselwa ukunciphisa i-deformation yebhodi yesekethe.Ibhodi yesekethe ipholile kwaye iyancipha emva kokunyuka kweqondo lokushisa eliphezulu ngokunyuka kwe-welding.Ukulungiswa kwetreyi kunokuzinzisa ibhodi yesekethe, kodwa isihluzo setreyi sibiza kakhulu, kwaye kufuneka sinyuse ukubekwa kwesandla setreyi.


Ixesha lokuposa: Sep-01-2021

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