Ngawaphi amanqaku akhethekileyo ekufuneka aqatshelwe kwimveliso ye-SMT?

I-SMT lelinye lamacandelo asisiseko amacandelo e-elektroniki, abizwa ngokuba ziindlela zokuhlanganisana zangaphandle, ezahlulwe azikho isikhonkwane okanye isikhokelo esifutshane, kungenkqubo yokuphinda kufakwe i-solder okanye idiphu i-solder kwindibano ye-welding yeendlela zendibano yesekethe, ikwayeyona idumileyo ngoku Ishishini lokuhlanganisa i-elektroniki ubuchule.Ngokusebenzisa inkqubo yeteknoloji ye-SMT ukunyusa amacandelo amancinci nakhaphukhaphu, ukuze ibhodi yesekethe igqibezele umjikelezo ophezulu, iimfuno ezincinci ze-miniaturization, ezikwakwi-SMT processing izakhono zicela phezulu.

I. SMT processing solder intlama kuyimfuneko ukuba ingqalelo

1. Ubushushu obuqhubekayo: inyathelo kwiqondo lokushisa lokugcinwa kwefriji ye-5 ℃ -10 ℃, nceda ungahambi ngaphantsi kwe-0 ℃.

2. Ngaphandle kokugcinwa: kufuneka ihambelane nezikhokelo zesizukulwana sokuqala sokuqala ngaphandle, musa ukwenza i-solder paste kwi-freezer yokugcina ixesha lide kakhulu.

3. Umkhenkce: Umkhenkce intlama ye-solder ngokwemvelo ubuncinane kwiiyure ezi-4 emva kokuyikhupha kwisikhenkcisi, musa ukuvala i-cap xa iqhwa.

4. Imeko: Iqondo lobushushu kwindibano yocweyo yi-25±2℃ kunye nokufuma okunxulumeneyo yi-45%-65%RH.

5. Isetyenzisiwe intlama ye-solder endala: Emva kokuvula isiciko senyathelo lokuncamathelisa i-solder kwiiyure ezili-12 ukuze usetyenziswe, ukuba ufuna ukuyigcina, nceda sebenzisa ibhotile engenanto ecocekileyo ukuyizalisa, kwaye emva koko itywinwe kwakhona kwisikhenkcisi ukuyigcina.

6. kwixabiso lokuncamathelisa kwi-stencil: okokuqala kwinani le-solder paste kwi-stencil, ukuze ushicilele ukujikeleza ungaweli ukuphakama kwe-scraper ye-1/2 njengento elungileyo, yenza uhlolo lwenkuthalo, ukongeza ngenkuthalo amaxesha ukongeza imali encinci.

II.SMT chip processing umsebenzi woshicilelo oluyimfuneko ukuze ingqalelo

1. I-scraper: izinto ze-scraper zingcono kakhulu ukuba zithathe i-steel scraper, zilungele ukuprinta kwi-PAD solder paste molding kunye nefilimu yokuhlutha.

I-angle ye-scraper: ukuprintwa kwencwadana ye-45-60 degrees;ukuprintwa koomatshini kwii-degrees ezingama-60.

Isantya sokushicilela: manual 30-45mm / min;mechanical 40mm-80mm / min.

Iimeko zoshicilelo: ubushushu kwi-23±3℃, ukufuma okunxulumene ne-45%-65%RH.

2. I-Stencil: Ukuvulwa kwe-stencil kusekelwe kubukhulu be-stencil kunye nemilo kunye nomlinganiselo wokuvula ngokwesicelo semveliso.

3. I-QFP / CHIP: isithuba esiphakathi singaphantsi kwe-0.5mm kunye ne-0402 CHIP kufuneka ivulwe nge-laser.

I-stencil yokuvavanya: ukumisa uvavanyo loxinzelelo lwe-stencil kanye ngeveki, ixabiso loxinzelelo liyacelwa ukuba libe ngaphezu kwe-35N / cm.

Ukucoca i-stencil: Xa ushicilela i-5-10 PCB ngokuqhubekayo, sula i-stencil kube kanye ngephepha lokusula elingenathuli.Akukho madlavu kufuneka asetyenziswe.

4. I-arhente yokucoca: IPA

I-solvent: Indlela efanelekileyo yokucoca i-stencil kukusebenzisa i-IPA kunye ne-alcohol solvents, ungasebenzisi i-solvents equkethe i-chlorine, kuba iya kulimaza ukubunjwa kwe-solder paste kwaye ichaphazele umgangatho.