Yintoni iBhodi yeSekethe yeHDI?

I. Yintoni ibhodi ye-HDI?

Ibhodi ye-HDI (i-High Density Interconnector), oko kukuthi, ibhodi yokudibanisa i-high-density interconnect, kukusetyenziswa kwe-micro-blind engcwatywe iteknoloji yomngxuma, ibhodi yesekethe enobuninzi obuphezulu bokusabalalisa umgca.Ibhodi ye-HDI inomgca wangaphakathi kunye nomgca wangaphandle, kwaye emva koko ukusetyenziswa kwe-drilling, i-metallization yemingxuma kunye nezinye iinkqubo, ukwenzela ukuba umaleko ngamnye wonxibelelwano lwangaphakathi lomgca.

II.umahluko phakathi kwebhodi HDI kunye PCB eqhelekileyo

Ibhodi ye-HDI ngokubanzi iveliswa kusetyenziswa indlela yokuqokelela, iileya ezininzi, ukuphakama kwebakala lobugcisa bebhodi.Ibhodi ye-HDI eqhelekileyo ngokusisiseko ixesha eli-1 elaminethiweyo, i-HDI yodidi oluphezulu usebenzisa i-2 okanye amaxesha angaphezulu kweteknoloji yokuhlambalaza, ngelixa ukusetyenziswa kwemingxuma egciniweyo, imingxuma yokuzalisa i-plating, i-laser ye-punching ngqo kunye nobunye ubuchwepheshe be-PCB obuphambili.Xa uxinaniso lwePCB lunyuka ngaphaya kwebhodi enemigangatho esibhozo, iindleko zokuvelisa nge-HDI ziya kuba ngaphantsi kwenkqubo yendabuko enzima yokushicilela.

Ukusebenza kombane kunye nokuchaneka komqondiso weebhodi ze-HDI ziphezulu kune-PCB zendabuko.Ukongezelela, iibhodi ze-HDI ziphuculwe ngcono kwi-RFI, i-EMI, ukukhutshwa kwe-static, i-thermal conductivity, njl. I-teknoloji ye-High Density Integration (HDI) inokwenza ukuba imveliso yoyilo lwemveliso igqitywe ngakumbi, ngelixa idibana nemigangatho ephezulu yokusebenza kwe-elektroniki kunye nokusebenza kakuhle.

III.izixhobo zebhodi ze-HDI

Izinto ze-HDI PCB zibeka phambili ezinye iimfuno ezintsha, ezibandakanya uzinzo olungcono lwe-dimensional, ukuhamba okuchasene ne-static kunye nokungancamathiseli.izinto eziqhelekileyo ze-HDI PCB yi-RCC (i-resin-coated copper).kukho iintlobo ezintathu ze-RCC, ezizezi, ifilimu ye-polyimide eyenziwe ngesinyithi, ifilimu ye-polyimide esulungekileyo, kunye nefilimu ephoswe nge-polyimide.

Iingenelo ze-RCC zibandakanya: ubukhulu obuncinci, ubunzima obukhanyayo, ukuguquguquka kunye nokutsha, ukuhambelana kweempawu kunye nozinzo oluhle kakhulu.Kwinkqubo ye-HDI ye-multilayer PCB, endaweni yephepha le-bonding yendabuko kunye ne-foil yobhedu njenge-insulating medium kunye ne-conductive layer, i-RCC inokucinezelwa ngobuchule obuqhelekileyo bokucinezela ngeechips.iindlela zokomba non-oomatshini ezifana laser ke zisetyenziswa ukuze zenze i-micro-through-hole interconnections.

I-RCC iqhuba ukwenzeka kunye nophuhliso lweemveliso ze-PCB ukusuka kwi-SMT (i-Surface Mount Technology) ukuya kwi-CSP (i-Chip Level Packaging), ukusuka kwi-drilling ngomatshini ukuya kwi-laser drilling, kwaye ikhuthaza uphuhliso kunye nokuqhubela phambili kwe-PCB microvia, yonke into ekhokelela kwi-HDI PCB. yeRCC.

Kwi-PCB yangempela kwinkqubo yokuvelisa, ekukhethweni kwe-RCC, ngokuqhelekileyo kukho i-FR-4 eqhelekileyo ye-Tg 140C, i-FR-4 ephezulu ye-Tg 170C kunye ne-FR-4 kunye ne-Rogers yokudibanisa i-laminate, esetyenziswa kakhulu namhlanje.Ngophuhliso lobuchwepheshe HDI, HDI PCB izinto kufuneka ukuhlangabezana neemfuno ngakumbi, ngoko ke iintsingiselo eziphambili HDI PCB izinto kufuneka

1. Ukuphuhliswa kunye nokusetyenziswa kwezixhobo eziguquguqukayo zisebenzisa i-adhesives

2. Ubukhulu be-dielectric layer encinci kunye nokuphambuka okuncinci

3 .uphuhliso lwe-LPIC

4. Iincinci ezincinci kunye ezincinci ze-dielectric constants

5. Ilahleko ezincinci kunye ezincinci zedielectric

6. Ukuzinza okuphezulu kwe-solder

7. Ihambelana ngokungqongqo ne-CTE (i-coefficient yokwandiswa kwe-thermal)

IV.ukusetyenziswa kobuchwepheshe bokuvelisa ibhodi ye-HDI

Ubunzima bokwenziwa kwe-HDI PCB yincinci ngokuvelisa, ngokusebenzisa i-metallization kunye nemigca emihle.

1. Ukwenziwa kweMicro-through-hole

Ukwenziwa kweMicro-through-hole yeyona ngxaki iphambili yokwenziwa kwe-HDI PCB.Kukho iindlela ezimbini eziphambili zokomba.

a.Ukugrumba okuqhelekileyo ngomngxuma, ukugrumba ngoomatshini kuhlala kungowona khetho lubalaseleyo ekusebenzeni kwawo okuphezulu kunye neendleko eziphantsi.Ngophuhliso lwesakhono sokwenza oomatshini, ukusetyenziswa kwayo kwi-micro-through-hole kuyavela.

b.Zimbini iindidi zokugrumba i-laser: i-photothermal ablation kunye ne-photochemical ablation.Eyangaphambili ibhekisa kwinkqubo yokufudumeza imathiriyeli yokusebenza ukuyinyibilikisa kwaye ikhuphe umphunga ngomngxuma owenziweyo emva kokufunxwa ngamandla kwelaser.Le yokugqibela ibhekisela kwisiphumo seefotoni zamandla aphezulu kummandla we-UV kunye nobude belaser obudlula i-400 nm.

Kukho iintlobo ezintathu zeenkqubo zelaser ezisetyenziselwa iiphaneli eziguquguqukayo neziqinileyo, ezizezi, i-excimer laser, i-UV laser drilling, kunye ne-CO 2 laser.Itekhnoloji yeLaser ayifanelekanga kuphela ukugaya, kodwa kunye nokusika kunye nokwenza.Kwanabanye abavelisi benza i-HDI ngelaser, kwaye nangona izixhobo zokomba i-laser zibiza kakhulu, zibonelela ngokuchaneka okuphezulu, iinkqubo ezizinzileyo kunye netekhnoloji eqinisekisiweyo.Izinto eziluncedo zobugcisa belaser zenza ukuba ibe yeyona ndlela isetyenziswa kakhulu kwimveliso eyimfama/engcwatywa ngomngxuma.Namhlanje, i-99% yemingxuma ye-HDI ye-microvia ifunyenwe ngokugrunjwa kwe-laser.

2. Ngokusebenzisa i-metallization

Obona bunzima kakhulu kwi-metallization yomngxuma bubunzima bokufikelela kwi-uniform plating.Kwitekhnoloji yokucoca umngxuma onzulu wemingxuma emincinci, ukongeza ekusebenziseni isisombululo esinamandla okusasaza okuphezulu, isisombululo seplating kwisixhobo sokucoca kufuneka siphuculwe ngexesha, elinokuthi lenziwe ngomatshini oqinileyo okanye ukungcangcazela, ukuvuselela i-ultrasonic, kunye ukutshiza okuthe tyaba.Ukongeza, ukufuma kodonga lomngxunya kufuneka kwandiswe phambi kokubekwa.

Ukongeza kuphuculo lwenkqubo, iindlela ze-HDI ngokusebenzisa i-metallization zibone ukuphuculwa kobuchwepheshe obuphambili: itekhnoloji yokongeza iikhemikhali, itekhnoloji yeplating ngokuthe ngqo, njl.

3. Umgca weFine

Ukuphunyezwa kwemigca emihle kubandakanya ukuhanjiswa komfanekiso oqhelekileyo kunye ne-laser imaging ngqo.Ugqithiso lwemifanekiso eqhelekileyo yinkqubo efanayo nesiqhelo sokuchongwa kweekhemikhali ukwenza imigca.

Ngomfanekiso we-laser ngqo, akukho filimu yezithombe efunekayo, kwaye umfanekiso wenziwa ngokuthe ngqo kwifilimu ye-photosensitive nge-laser.Ukukhanya kwamaza e-UV kusetyenziselwa ukusebenza, okwenza izisombululo zokugcinwa kwamanzi zihlangabezane neemfuno zesisombululo esiphezulu kunye nokusebenza okulula.Akukho mfanekiso wefilimu ofunekayo ukuze ugweme iziphumo ezingathandekiyo ngenxa yeziphene zefilimu, ukuvumela uxhulumaniso oluthe ngqo kwi-CAD/CAM kunye nokunciphisa umjikelo wokuvelisa, okwenza ukuba ifanelekele ukuveliswa okulinganiselweyo kunye nokuninzi.

I-Zhejiang NeoDen Technology Co., LTD., Yasekwa ngo-2010, ngumvelisi oqeqeshiweyo okhethekileyo kwi-SMT yokukhetha kunye nokubeka umatshini,reflow oven, umatshini wokushicilela we-stencil, umgca wemveliso we-SMT kunye nezinyeIimveliso ze-SMT.Sineqela lethu le-R & D kunye nemizi-mveliso yethu, sithatha ithuba le-R&D yethu etyebileyo, imveliso eqeqeshwe kakuhle, yaphumelela igama elihle kubathengi behlabathi ngokubanzi.

Kule minyaka ilishumi, siye savelisa ngokuzimeleyo iNeoDen4, NeoDen IN6, NeoDen K1830, NeoDen FP2636 kunye nezinye iimveliso ze-SMT, ezithengiswe kakuhle kwihlabathi jikelele.

Sikholelwa ukuba abantu abakhulu kunye namahlakani enza iNeoDen ibe yinkampani enkulu kwaye ukuzinikela kwethu kuTshintsho, iyantlukwano kunye noZinzo kuqinisekisa ukuba i-SMT automation iyafikeleleka kuye wonke umntu othanda ukuzonwabisa kuyo yonke indawo.