1. Icala lenkqubo liyilwe kwicala elifutshane.
2. Izixhobo ezifakwe kufuphi ne-gap zingonakaliswa xa ibhodi inqunywe.
3. Ibhodi yePCB yenziwe ngezinto zeTEFLON ezinobunzima obuyi-0.8mm.Izinto eziphathekayo zithambile kwaye kulula ukuzikhubaza.
4. PCB wamkela V-cut kunye nenkqubo yoyilo slot elide kwicala transmission.Ngenxa yokuba ububanzi becandelo loqhagamshelo buyi-3mm kuphela, kwaye kukho i-crystal vibration enzima, i-socket kunye nezinye izinto zeplagi ebhodini, i-PCB iya kwaphuka ngexesha.reflow oveni-welding, kwaye ngamanye amaxesha i-phenomenon ye-transmission side fracture yenzeke ngexesha lokufakwa.
5. Ubukhulu bebhodi yePCB yi-1.6mm kuphela.Izinto ezinzima ezifana nemodyuli yamandla kunye nekhoyili zibekwe phakathi kobubanzi bebhodi.
6. PCB yokufakela amacandelo BGA wamkela Yin Yang uyilo ibhodi.
a.PCB deformation kubangelwa Yin kunye Yang ibhodi uyilo amacandelo enzima.
b.PCB yokuhlohla BGA amacandelo ezigqunyiweyo wamkela Yin kunye noyilo ipleyiti Yang, okubangela ukuba angathembekanga BGA amalungu solder
c.Ipleyiti enemilo ekhethekileyo, ngaphandle kokudibanisa imbuyekezo, inokungena kwisixhobo ngendlela efuna izixhobo kunye nokwandisa iindleko zokuvelisa.
d.Zonke iibhodi ezine zokuhlanganisa zisebenzisa indlela yesitampu sokudibanisa umngxuma, onamandla aphantsi kunye nokuguqulwa okulula.
Ixesha lokuposa: Sep-10-2021