Kutheni i-Flux ibaluleke kangaka kwiBhodi yeSekethe yePCBA?

1. Umgaqo we-welding we-Flux

I-Flux inokuthwala umphumo we-welding, kuba ii-athomu zetsimbi zisondelene nomnye emva kokusabalalisa, ukuchithwa, ukungena kunye nezinye iziphumo.Ukongeza kwimfuno yokuhlangabezana nokususwa kweeoksidi kunye nezingcolisi ekusebenzeni kokusebenza, kodwa kunye nokuhlangabezana ne-non-corrosive, i-insulation, ukumelana nokufuma, ukuzinza, ukungabi nabungozi, ukucoceka kunye nezinye iimfuno.Ngokuqhelekileyo, iinqununu zayo eziphambili ziyi-agent esebenzayo, ifilimu - ukwenza izinto, izongezo, i-solvents kunye nokunye.

2. Susa i-oxide ebusweni bentsimbi edibeneyo

Kwimekobume yomoya eqhelekileyo, kuhlala kukho iioksidi kumphezulu wesinyithi wepadi yokuwelda.Ezi oxides ziya kuba nempembelelo ethile ekumanziseni kwe-solder ngexesha lenkqubo ye-welding, eya kuchaphazela inkqubo ye-welding kunye neziphumo ze-welding.Ngoko ke, i-flux kufuneka ikwazi ukunciphisa i-oxide, kunye ne-welding ye-PCBA processing inokwenziwa ngokuqhelekileyo.

3. Thintela i-oxidation yesibini

Kwinkqubo ye-welding ye-PCBA processing, ukufudumeza kuyadingeka.Nangona kunjalo, kwinkqubo yokufudumala, i-oxidation esheshayo iya kwenzeka kwindawo yesinyithi ngenxa yokunyuka kweqondo lokushisa.Ngeli xesha, i-flux iyadingeka ukuze idlale indima ekuthinteleni i-oxidation yesibini.

4. Nciphisa i-tension ye-solder etyhidiweyo

Ngenxa yokwakheka komzimba, umphezulu we-solder otyhidiweyo uya kuba noxinzelelo oluthile, kwaye ukuxinana komphezulu kuya kukhokelela kwisantya sokuhamba kwe-solder ukuya kwindawo ye-welding ukuchaphazela ukumanzisa okuqhelekileyo kwinkqubo ye-welding, kunye nomsebenzi we-flux kule. ixesha kukunciphisa uxinzelelo lomphezulu we-solder engamanzi, ukwenzela ukuba ukumanzi kunokuphucula kakhulu.

Iprinta yeStencil yeSolder


Ixesha lokuposa: Jul-26-2021

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