Iindaba
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Ukubaluleka kokuLungiswa kokubekwa kwe-SMT ngeRayithi
Ukusetyenzwa kokubekwa kwe-SMT, ngesantya kubizwa ngokuba ngumgca wokuphila weplanti yokubeka, ezinye iinkampani kufuneka zifikelele kwi-95% ngesantya sifikelele kumgca oqhelekileyo, ngoko ke ngesantya esiphezulu nesisezantsi, esibonisa amandla obugcisa beplanti yokubekwa, umgangatho wenkqubo. , ngomlinganiselo c...Funda ngokugqithisileyo -
Luluphi ulungelelwaniso kunye neNgqwalasela kwiNdlela yoLawulo yeCOFT?
Intshayelelo yetshiphu yomqhubi we-LED kunye nophuhliso olukhawulezayo lweshishini lombane weemoto, iitshiphusi zomqhubi we-LED ezinoxinaniso olubanzi olunoluhlu olubanzi lwamandla ombane zisetyenziswa ngokubanzi ekukhanyeni kweemoto, kubandakanywa izibane zangaphandle nangasemva, ukukhanya kwangaphakathi kunye nokubonisa ukukhanya.Umqhubi we-LED ch...Funda ngokugqithisileyo -
Zeziphi iindawo zobuGcisa zokuKhetha iWave Soldering?
Inkqubo yokutshiza ye-Flux yokukhetha umatshini wokushushumbisa umatshini wokutshiza usetyenziselwa ukuthambisa okukhethiweyo, oko kukuthi umlomo wombhobho ubaleka ukuya kwindawo echongiweyo ngokwemiyalelo ecwangcisiweyo emva koko ugungxulela kuphela indawo ebhodini ekufuneka ithengiswe (indawo yokutshiza kunye lin...Funda ngokugqithisileyo -
14 Iimpazamo zoYilo lwePCB eziqhelekileyo kunye nezizathu
1. PCB akukho edge inkqubo, imingxuma inkqubo, ayikwazi ukuhlangabezana neemfuno SMT isixhobo clamping, nto leyo ethetha ukuba ayikwazi ukuhlangabezana neemfuno imveliso yobuninzi.2. I-PCB imilo yasemzini okanye ubungakanani obukhulu kakhulu, buncinci kakhulu, obufanayo abanakuhlangabezana neemfuno zezixhobo zokubamba.3. PCB, FQFP pads aun...Funda ngokugqithisileyo -
Ugcinwa njani uMxubi weNcama yeSolder?
I-solder paste mixer inokudibanisa ngokufanelekileyo i-solder powder kunye ne-flux paste.I-solder paste isuswa kwifriji ngaphandle kwesidingo sokuphinda uhlambulule i-paste, ukuphelisa isidingo sokuhlaziya ixesha.Umphunga wamanzi woma ngokwemvelo ngexesha lenkqubo yokuxuba, ukunciphisa ithuba lokuphuma ...Funda ngokugqithisileyo -
IChip Component Pad Design iziphene
1. I-0.5mm pitch QFP ubude bephedi ide kakhulu, ibangela isiphaluka esifutshane.2. Iipadi ze-socket ze-PLCC zifutshane kakhulu, ezikhokelela ekuthengiseni okungamanga.3. Ubude bePad be-IC bude kakhulu kwaye inani le-solder paste likhulu libangela isiphaluka esifutshane ekuqhutyeni kwakhona.4. Iipads ze-Wing chip zinde kakhulu zichaphazela isithende sokuzaliswa kwe-solder ...Funda ngokugqithisileyo -
UkuFunyaniswa kweNdlela yeNgxaki yokuSonga kwi-PCBA
I. Izizathu eziqhelekileyo zokuvelisa i-solder yobuxoki 1. I-Solder melting point iphantsi kakhulu, amandla awakho mkhulu.2. Isixa setoti esisetyenziselwa ukuwelda sincinci kakhulu.3. Umgangatho ophantsi we-solder ngokwayo.4. Izikhonkwane zecandelo zikhona isenzeko soxinzelelo.5. Amacandelo aveliswa yi-hig...Funda ngokugqithisileyo -
Isaziso seHolide esivela kuNeoDen
Iinyani ezikhawulezayo malunga neNeoDen ① Yasekwa ngo-2010, 200+ abasebenzi, 8000+ Sq.m.Ifektri ② Iimveliso zeNeoDen: I-Smart series PNP machine, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, reflow oven IN6, IN12, Solder paste printer FP260c00+ abathengi abaphumeleleyo FP3040cFunda ngokugqithisileyo -
UziSombulula njani iingxaki eziqhelekileyo kuYilo lweSekethe yePCB?
I. I-pad overlap 1. Ukudityaniswa kweepads (ukongeza kwiipads zokuncamathelisa ngaphezulu) kuthetha ukuba ukudityaniswa kwemingxunya, kwinkqubo yokomba kuya kukhokelela kwiqhekeza le-drill bit ngenxa yokomba kaninzi kwindawo enye, okukhokelela kumonakalo kumngxuma. .2. Ibhodi ye-Multilayer kwimingxuma emibini ewelanayo, efana nomngxuma ...Funda ngokugqithisileyo -
Zeziphi iindlela zokuphucula ukuthengiselwa kwebhodi yePCBA?
Kwinkqubo PCBA processing, kukho iinkqubo ezininzi imveliso, ekulula ukuvelisa iingxaki ezininzi umgangatho.Ngeli xesha, kuyimfuneko ukuba rhoqo ukuphucula indlela PCBA welding kunye nokuphucula inkqubo ngempumelelo ukuphucula umgangatho imveliso.I. Phucula iqondo lobushushu kunye...Funda ngokugqithisileyo -
Ibhodi yeSekethe ye-Thermal Conductivity kunye ne-Heat Dissipation Design Processability iimfuno
1. Imilo ye-heat sinki, ubukhulu kunye nommandla woyilo Ngokweemfuno zoyilo lwe-thermal yamacandelo afunekayo okutshatyalaliswa kobushushu kufuneka ziqwalaselwe ngokupheleleyo, kufuneka kuqinisekiswe ukuba ubushushu besiphambuka samacandelo avelisa ubushushu, ubushushu bomphezulu wePCB ukuhlangabezana noyilo lwemveliso req. ...Funda ngokugqithisileyo -
Ngawaphi aManyathelo okutshiza iPeyinti yobungqina obuThathu?
Inyathelo 1: Coca umphezulu webhodi.Gcina umphezulu webhodi ungenayo ioli kunye nothuli (ikakhulukazi i-flux ukusuka kwi-solder ekhohlo kwinkqubo ye-oven yokubuyisela kwakhona).Ngenxa yokuba le nto ibaluleke kakhulu, iya kuchaphazela ukuqina kwamacandelo kunye nokunamathela kwepeyinti yobungqina obuthathu kunye nebhodi.Inyathelo lesi-2: Yomisa...Funda ngokugqithisileyo
